Shin Teraki

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Niigata-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Shield method for electronic component enclosure and shield material
- Patent number 8,015,690
- Issue date Sep 13, 2011
- SMK Corporation
- Yoshikazu Ueno
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING S...
- Publication number 20240360310
- Publication date Oct 31, 2024
- NAMICS CORPORATION
- Hirotatsu IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-EQUIPPED SEMICONDUCTOR PACKAGE AND RESIN COMPOSITION FOR AN...
- Publication number 20230299461
- Publication date Sep 21, 2023
- NAMICS CORPORATION
- Hiroshi Takasugi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR FILM, FILM, FILM WITH BASE MATERIAL, METAL/RE...
- Publication number 20190160785
- Publication date May 30, 2019
- Namics Corporation
- Fumikazu KOMATSU
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
- Publication number 20090239992
- Publication date Sep 24, 2009
- Toshiaki Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Shield method for electronic component enclosure and shield material
- Publication number 20090223711
- Publication date Sep 10, 2009
- Yoshikazu Ueno
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Epoxy Resin Composition
- Publication number 20080020231
- Publication date Jan 24, 2008
- Toshiaki Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...