Shineng Ma

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having thermally conductive pathways
- Patent number 11,508,644
- Issue date Nov 22, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side contact pads for high-speed memory card
- Patent number 11,425,817
- Issue date Aug 23, 2022
- Western Digital Technologies, Inc.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and semiconductor package
- Patent number 11,355,485
- Issue date Jun 7, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity semiconductor device including bifurcated memory module
- Patent number 11,276,669
- Issue date Mar 15, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including control switches to reduce pin capac...
- Patent number 11,177,239
- Issue date Nov 16, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including optically connected wafer stack
- Patent number 10,734,354
- Issue date Aug 4, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS
- Publication number 20220216128
- Publication date Jul 7, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE CONTACT PADS FOR HIGH-SPEED MEMORY CARD
- Publication number 20210400811
- Publication date Dec 23, 2021
- Western Digital Technologies, Inc.
- SHINENG MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE
- Publication number 20200411496
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE
- Publication number 20200411480
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK
- Publication number 20190198479
- Publication date Jun 27, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...
- Publication number 20190006320
- Publication date Jan 3, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device package having thermally conductive pathways

Side contact pads for high-speed memory card

Semiconductor die and semiconductor package

High capacity semiconductor device including bifurcated memory module

Semiconductor device including control switches to reduce pin capac...

Semiconductor device including optically connected wafer stack

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS

SIDE CONTACT PADS FOR HIGH-SPEED MEMORY CARD

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE

HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE

SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK

SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...