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Shineng Ma
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device package having thermally conductive pathways
Patent number
11,508,644
Issue date
Nov 22, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side contact pads for high-speed memory card
Patent number
11,425,817
Issue date
Aug 23, 2022
Western Digital Technologies, Inc.
Shineng Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die and semiconductor package
Patent number
11,355,485
Issue date
Jun 7, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High capacity semiconductor device including bifurcated memory module
Patent number
11,276,669
Issue date
Mar 15, 2022
Western Digital Technologies, Inc.
Xuyi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including control switches to reduce pin capac...
Patent number
11,177,239
Issue date
Nov 16, 2021
SanDisk Information Technology (Shanghai) Co., Ltd.
Shineng Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including optically connected wafer stack
Patent number
10,734,354
Issue date
Aug 4, 2020
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS
Publication number
20220216128
Publication date
Jul 7, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDE CONTACT PADS FOR HIGH-SPEED MEMORY CARD
Publication number
20210400811
Publication date
Dec 23, 2021
Western Digital Technologies, Inc.
SHINENG MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE
Publication number
20200411496
Publication date
Dec 31, 2020
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE
Publication number
20200411480
Publication date
Dec 31, 2020
Western Digital Technologies, Inc.
Xuyi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK
Publication number
20190198479
Publication date
Jun 27, 2019
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin-Tien Chiu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...
Publication number
20190006320
Publication date
Jan 3, 2019
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Shineng Ma
H01 - BASIC ELECTRIC ELEMENTS