Shing Chen

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,033,992
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,776,838
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for recovering lithium
- Patent number 11,530,133
- Issue date Dec 20, 2022
- Industrial Technology Research Institute
- Li-Ching Chung
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Chip package with fan-out structure
- Patent number 11,404,381
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, manufacturing method of semiconductor device...
- Patent number 11,177,156
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,088,124
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and methods of using the same
- Patent number 10,964,663
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and methods of using the same
- Patent number 10,950,572
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing method of integrated fan-out package
- Patent number 10,867,953
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with fan-out structure
- Patent number 10,840,111
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and rework process for the same
- Patent number 10,797,038
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with fan-out structure
- Patent number 10,515,900
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and methods of using the same
- Patent number 10,475,764
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,283,470
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,276,537
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package involving cutting process
- Patent number 10,157,846
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 10,128,193
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with fan-out structure
- Patent number 9,947,552
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RDL-first packaging process
- Patent number 9,425,178
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321848
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230360949
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH FAN-OUT FEATURE
- Publication number 20220336363
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOLOGICAL DESULFURIZATION PROCESSING METHOD AND BIOLOGICAL DESULFU...
- Publication number 20220241724
- Publication date Aug 4, 2022
- Industrial Technology Research Institute
- Jia-Jun TEE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220076982
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210366885
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE
- Publication number 20210280520
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECOVERING LITHIUM
- Publication number 20210188652
- Publication date Jun 24, 2021
- Industrial Technology Research Institute
- Li-Ching Chung
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...
- Publication number 20210057259
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH FAN-OUT STRUCTURE
- Publication number 20200135652
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Methods of Using the Same
- Publication number 20200066674
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Application
Die Bonder and Methods of Using the Same
- Publication number 20200066673
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200058627
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE
- Publication number 20190252339
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH FAN-OUT STRUCTURE
- Publication number 20190122989
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190096840
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337149
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH FAN-OUT STRUCTURE
- Publication number 20180233382
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180151500
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE
- Publication number 20180108613
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE
- Publication number 20170316957
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND REWORK PROCESS FOR THE SAME
- Publication number 20170250171
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Methods of Using the Same
- Publication number 20160190088
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Application
RDL-FIRST PACKAGING PROCESS
- Publication number 20160013172
- Publication date Jan 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION AND DISPLAY SYSTEM AND METHOD
- Publication number 20080159191
- Publication date Jul 3, 2008
- Industrial Technology Research Institute
- Chien-Hsiung Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Supercritical CO2 cleaning system and method
- Publication number 20070144555
- Publication date Jun 28, 2007
- Industrial Technology Research Institute
- Cheng-Chun Chen
- B08 - CLEANING

Person

Patents Grantslast 30 patents

Package structure with fan-out feature

Formation method of chip package with fan-out structure

Package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Method for recovering lithium

Chip package with fan-out structure

Semiconductor package, manufacturing method of semiconductor device...

Package and manufacturing method thereof

Die bonder and methods of using the same

Die bonder and methods of using the same

Manufacturing method of integrated fan-out package

Chip package with fan-out structure

Semiconductor package and rework process for the same

Chip package with fan-out structure

Die bonder and methods of using the same

Semiconductor package and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Method for forming chip package involving cutting process

Package structure and method for forming the same

Structure and formation method of chip package with fan-out structure

RDL-first packaging process

Patents Applicationslast 30 patents

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH FAN-OUT FEATURE

BIOLOGICAL DESULFURIZATION PROCESSING METHOD AND BIOLOGICAL DESULFU...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND MANUFACTURING METHOD THEREOF

FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE

METHOD FOR RECOVERING LITHIUM

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...

CHIP PACKAGE WITH FAN-OUT STRUCTURE

Die Bonder and Methods of Using the Same

Die Bonder and Methods of Using the Same

PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE

CHIP PACKAGE WITH FAN-OUT STRUCTURE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE WITH FAN-OUT STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE

SEMICONDUCTOR PACKAGE AND REWORK PROCESS FOR THE SAME

Die Bonder and Methods of Using the Same

RDL-FIRST PACKAGING PROCESS

WIRELESS COMMUNICATION AND DISPLAY SYSTEM AND METHOD

Supercritical CO2 cleaning system and method