Shing-Chyang Pan

Person

Jhudong Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Diffusion barrier layer in programmable metallization cell
- Patent number 12,245,529
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Zhong
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 12,151,932
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 12,074,058
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for fabricating the same
- Patent number 11,991,930
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co, Ltd.
- Jung-Tang Wu
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 11,814,283
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Diffusion barrier layer in programmable metallization cell
- Patent number 11,778,931
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Zhong
Information Patent Grant
Metal-based etch-stop layer
- Patent number 11,769,693
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectromechanical systems (MEMS) devices to cont...
- Patent number 11,697,588
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 11,676,852
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer for semiconductor devices
- Patent number 11,651,993
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer in programmable metallization cell
- Patent number 11,594,678
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for fabricating the same
- Patent number 11,515,474
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition chamber with target surface morphology mo...
- Patent number 11,479,849
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etch stop layer for semiconductor devices
- Patent number 11,322,396
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectromechanical systems (MEMS) devices to cont...
- Patent number 11,198,606
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-patterning to form vias with straight profiles
- Patent number 11,049,763
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 11,040,870
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal-based etch-stop layer
- Patent number 11,004,734
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Morphology of resist mask prior to etching
- Patent number 10,978,301
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 10,867,839
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 10,862,026
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with etch stop layer
- Patent number 10,811,263
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Ling Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 10,727,045
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch stop layer for semiconductor devices
- Patent number 10,685,873
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure, MRAM device using the via structure and method for f...
- Patent number 10,535,816
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with etch stop layer
- Patent number 10,522,360
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Ling Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated resputtering in a physical vapor...
- Patent number 10,515,788
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chyang Pan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-patterning to form vias with straight profiles
- Patent number 10,510,585
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-based etch-stop layer
- Patent number 10,468,297
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio gap fill
- Patent number 10,361,112
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240282571
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIFFUSION BARRIER LAYER IN PROGRAMMABLE METALLIZATION CELL
- Publication number 20230413696
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Albert Zhong
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20230382712
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20230294978
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PATTERNING METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20230260829
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230073308
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER IN PROGRAMMABLE METALLIZATION CELL
- Publication number 20220367801
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Albert Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL VAPOR DEPOSITION CHAMBER WITH TARGET SURFACE MORPHOLOGY MO...
- Publication number 20220349045
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hai-Dang Trinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Etch Stop Layer for Semiconductor Devices
- Publication number 20220254680
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20220089434
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20210309508
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFUSION BARRIER LAYER IN PROGRAMMABLE METALLIZATION CELL
- Publication number 20210280780
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Albert Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Based Etch-Stop Layer
- Publication number 20210280460
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Methods for Semiconductor Devices
- Publication number 20210134656
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210119120
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20210087055
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20210024348
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL VAPOR DEPOSITION CHAMBER WITH TARGET SURFACE MORPHOLOGY MO...
- Publication number 20200377997
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hai-Dang Trinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Manufacturing a Semiconductor Device
- Publication number 20200357634
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch Stop Layer for Semiconductor Devices
- Publication number 20200279770
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20200152864
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH ETCH STOP LAYER
- Publication number 20200144063
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Ling LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Patterning to Form Vias with Straight Profiles
- Publication number 20200090984
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Morphology of Resist Mask Prior to Etching
- Publication number 20200075319
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Based Etch-Stop Layer
- Publication number 20200066581
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Methods for Semiconductor Devices
- Publication number 20190385902
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Based Etch-Stop Layer
- Publication number 20190333807
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE, MRAM DEVICE USING THE VIA STRUCTURE AND METHOD FOR F...
- Publication number 20190157548
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device
- Publication number 20190103272
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO GAP FILL
- Publication number 20190006227
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS

Shing-Chyang Pan

Person

Patents Grantslast 30 patents

Diffusion barrier layer in programmable metallization cell

Microelectromechanical systems device having a mechanically robust...

Patterning methods for semiconductor devices

Memory device and method for fabricating the same

Microelectromechanical systems device having a mechanically robust...

Diffusion barrier layer in programmable metallization cell

Metal-based etch-stop layer

Structure for microelectromechanical systems (MEMS) devices to cont...

Patterning methods for semiconductor devices

Etch stop layer for semiconductor devices

Diffusion barrier layer in programmable metallization cell

Memory device and method for fabricating the same

Physical vapor deposition chamber with target surface morphology mo...

Etch stop layer for semiconductor devices

Structure for microelectromechanical systems (MEMS) devices to cont...

Multi-patterning to form vias with straight profiles

Microelectromechanical systems device having a mechanically robust...

Metal-based etch-stop layer

Morphology of resist mask prior to etching

Patterning methods for semiconductor devices

Memory device

Method for forming semiconductor device structure with etch stop layer

Method for manufacturing a semiconductor device

Etch stop layer for semiconductor devices

Via structure, MRAM device using the via structure and method for f...

Method for forming semiconductor device structure with etch stop layer

Systems and methods for integrated resputtering in a physical vapor...

Multi-patterning to form vias with straight profiles

Metal-based etch-stop layer

High aspect ratio gap fill

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

DIFFUSION BARRIER LAYER IN PROGRAMMABLE METALLIZATION CELL

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

PATTERNING METHODS FOR SEMICONDUCTOR DEVICES

MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

DIFFUSION BARRIER LAYER IN PROGRAMMABLE METALLIZATION CELL

PHYSICAL VAPOR DEPOSITION CHAMBER WITH TARGET SURFACE MORPHOLOGY MO...

Etch Stop Layer for Semiconductor Devices

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

DIFFUSION BARRIER LAYER IN PROGRAMMABLE METALLIZATION CELL

Metal-Based Etch-Stop Layer

Patterning Methods for Semiconductor Devices

MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

PHYSICAL VAPOR DEPOSITION CHAMBER WITH TARGET SURFACE MORPHOLOGY MO...

Method for Manufacturing a Semiconductor Device

Etch Stop Layer for Semiconductor Devices

MEMORY DEVICE

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH ETCH STOP LAYER

Multi-Patterning to Form Vias with Straight Profiles

Morphology of Resist Mask Prior to Etching

Metal-Based Etch-Stop Layer

Patterning Methods for Semiconductor Devices

Metal-Based Etch-Stop Layer

VIA STRUCTURE, MRAM DEVICE USING THE VIA STRUCTURE AND METHOD FOR F...

Method for Manufacturing a Semiconductor Device

HIGH ASPECT RATIO GAP FILL