Shing-Fun Ho

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of forming the same
- Patent number 10,269,692
- Issue date Apr 23, 2019
- Nan Ya Printed Circuit Board Corporation
- Chin-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of integrated packed fuel cell
- Patent number 7,597,979
- Issue date Oct 6, 2009
- Nan Ya Printed Circuit Board Corporation
- Yung-Yi Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a flat panel direct methanol fuel cell
- Patent number 7,592,093
- Issue date Sep 22, 2009
- Nan Ya Printed Circuit Board Corporation
- Yung-Yi Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lot traceable printed circuit board
- Patent number 7,576,287
- Issue date Aug 18, 2009
- Nan Ya Printed Circuit Board Corporation
- Hsing-Lun Lo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a flat panel direct methanol fuel cell
- Patent number 7,531,263
- Issue date May 12, 2009
- Nan Ya Printed Circuit Board Corporation
- Yung-Yi Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Embedded chip package with improved heat dissipation performance an...
- Patent number 7,528,482
- Issue date May 5, 2009
- Nan Ya Printed Circuit Board Corporation
- Cheng-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing double-sided printed circuit board
- Patent number 7,524,429
- Issue date Apr 28, 2009
- Nan Ya Printed Circuit Board Corporation
- Hung-En Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a packaging substrate
- Patent number 7,045,460
- Issue date May 16, 2006
- Nan Ya Printed Circuit Board Corporation
- Yi-Tang Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOT TRACEABLE PRINTED CIRCUIT BOARD
- Publication number 20080149732
- Publication date Jun 26, 2008
- Hsing-Lun Lo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CHIP PACKAGE WITH IMPROVED HEAT DISSIPATION PERFORMANCE AN...
- Publication number 20080116569
- Publication date May 22, 2008
- Cheng-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DOUBLE-SIDED PRINTED CIRCUIT BOARD
- Publication number 20070084823
- Publication date Apr 19, 2007
- Hung-En Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a flat panel direct methanol fuel cell
- Publication number 20060292435
- Publication date Dec 28, 2006
- Yung-Yi Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure of Integrated Packed Fuel Cell
- Publication number 20060121328
- Publication date Jun 8, 2006
- Yung-Yi Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of Manufacturing Double-Sided Printed Circuit Board
- Publication number 20060054588
- Publication date Mar 16, 2006
- Hung-En Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A FLAT PANEL DIRECT METHANOL FUEL CELL
- Publication number 20060040169
- Publication date Feb 23, 2006
- Yung-Yi LIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Shing-Fun Ho

Person

Patents Grantslast 30 patents

Package structure and method of forming the same

Structure of integrated packed fuel cell

Method for manufacturing a flat panel direct methanol fuel cell

Lot traceable printed circuit board

Method of fabricating a flat panel direct methanol fuel cell

Embedded chip package with improved heat dissipation performance an...

Method of manufacturing double-sided printed circuit board

Method for fabricating a packaging substrate

Patents Applicationslast 30 patents

LOT TRACEABLE PRINTED CIRCUIT BOARD

EMBEDDED CHIP PACKAGE WITH IMPROVED HEAT DISSIPATION PERFORMANCE AN...

METHOD OF MANUFACTURING DOUBLE-SIDED PRINTED CIRCUIT BOARD

Method for manufacturing a flat panel direct methanol fuel cell

Structure of Integrated Packed Fuel Cell

Method of Manufacturing Double-Sided Printed Circuit Board

METHOD OF FABRICATING A FLAT PANEL DIRECT METHANOL FUEL CELL