Shing-Sing Chiang

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating oxide layers with different thicknesses
- Patent number 6,660,593
- Issue date Dec 9, 2003
- Winbond Electronics Corp.
- Shing-Sing Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an inductor
- Patent number 6,083,802
- Issue date Jul 4, 2000
- Winbond Electronics Corporation
- Wen Ying Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for preventing bonding pads from peeling cause...
- Patent number 6,034,439
- Issue date Mar 7, 2000
- Winbond Electronics Corporation
- Kuo-Shi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a voidless IC electrical plug
- Patent number 5,739,047
- Issue date Apr 14, 1998
- Winbond Electronics Corporation
- Shing-Shing Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for fabricating oxide layers with different thicknesses
- Publication number 20020081798
- Publication date Jun 27, 2002
- Shing-Sing Chiang
- H01 - BASIC ELECTRIC ELEMENTS