Shing Yeh

Person

Buffalo Grove, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid metal rotary connector apparatus for a vehicle steering whee...
- Patent number 7,726,972
- Issue date Jun 1, 2010
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Compression connection for vertical IC packages
- Patent number 7,447,041
- Issue date Nov 4, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-based solder alloys containing copper
- Patent number 6,811,892
- Issue date Nov 2, 2004
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and solder reflow process
- Patent number 6,767,411
- Issue date Jul 27, 2004
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leach-resistant solder alloys for silver-based thick-film conductors
- Patent number 6,630,251
- Issue date Oct 7, 2003
- Delphi Technologies, Inc.
- Bradley H. Carter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder process and solder alloy therefor
- Patent number 6,619,536
- Issue date Sep 16, 2003
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder process and solder alloy therefor
- Patent number 6,570,260
- Issue date May 27, 2003
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of solder bumping a circuit component
- Patent number 6,281,106
- Issue date Aug 28, 2001
- Delphi Technologies, Inc.
- William David Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount circuit device and solder bumping method therefor
- Patent number 6,251,501
- Issue date Jun 26, 2001
- Delphi Technologies, Inc.
- William David Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for bonding micromachined wafers using solder
- Patent number 6,062,461
- Issue date May 16, 2000
- Delphi Technologies, Inc.
- Douglas Ray Sparks
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fatigue-resistant lead-free alloy
- Patent number 5,938,862
- Issue date Aug 17, 1999
- Delco Electronics Corporation
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite solder paste for flip chip bumping
- Patent number 5,803,340
- Issue date Sep 8, 1998
- Delco Electronics Corporation
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump transfer device for flip chip integrated circuit devices
- Patent number 5,607,099
- Issue date Mar 4, 1997
- Delco Electronics Corporation
- Shing Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress terminal pattern for integrated circuit devices and...
- Patent number 5,491,364
- Issue date Feb 13, 1996
- Delco Electronics Corporation
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD OF FORMING A MECHANICAL SUPPORT FOR AN ELECTRONIC...
- Publication number 20120168208
- Publication date Jul 5, 2012
- Delphi Technologies, Inc.
- WAYNE A. SOZANSKY
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Compression connection for vertical IC packages
- Publication number 20080212296
- Publication date Sep 4, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly and manufacturing method having a reduced need...
- Publication number 20080012099
- Publication date Jan 17, 2008
- Shing Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with controlled solder joint thickness
- Publication number 20060255476
- Publication date Nov 16, 2006
- Frederick F. Kuhlman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead-based solder alloys containing copper
- Publication number 20040035909
- Publication date Feb 26, 2004
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder alloy and solder reflow process
- Publication number 20030175146
- Publication date Sep 18, 2003
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PROCESS AND SOLDER ALLOY THEREFOR
- Publication number 20030155402
- Publication date Aug 21, 2003
- DELPHI TECHNOLOGIES, INC.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Liquid metal rotary connector apparatus for a vehicle steering whee...

Compression connection for vertical IC packages

Lead-based solder alloys containing copper

Lead-free solder alloy and solder reflow process

Leach-resistant solder alloys for silver-based thick-film conductors

Solder process and solder alloy therefor

Solder process and solder alloy therefor

Method of solder bumping a circuit component

Surface mount circuit device and solder bumping method therefor

Process for bonding micromachined wafers using solder

Fatigue-resistant lead-free alloy

Composite solder paste for flip chip bumping

Solder bump transfer device for flip chip integrated circuit devices

Reduced stress terminal pattern for integrated circuit devices and...

Patents Applicationslast 30 patents

SYSTEM AND METHOD OF FORMING A MECHANICAL SUPPORT FOR AN ELECTRONIC...

Compression connection for vertical IC packages

Electronic assembly and manufacturing method having a reduced need...

Electronic assembly with controlled solder joint thickness

Lead-based solder alloys containing copper

Lead-free solder alloy and solder reflow process

SOLDER PROCESS AND SOLDER ALLOY THEREFOR