Shingetsu Yamada

Person

Hiratsuka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal substrate and light source device
- Patent number 8,742,432
- Issue date Jun 3, 2014
- Mitsubishi Chemical Corporation
- Yoshihito Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal laminated body, LED-mounted substrate, and white film
- Patent number 8,169,129
- Issue date May 1, 2012
- Mitsubishi Plastics, Inc.
- Jun Matsui
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,044,304
- Issue date Oct 25, 2011
- Mitsubishi Plastics, Inc.
- Shingetsu Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 7,334,324
- Issue date Feb 26, 2008
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device integrated multilayer wiring board
- Patent number 7,022,399
- Issue date Apr 4, 2006
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat resistant resin composition, a heat resistant film or sheet th...
- Patent number 6,824,884
- Issue date Nov 30, 2004
- Mitsubishi Plastics, Inc.
- Kouichirou Taniguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer wiring board, semiconductor device mounting board using...
- Patent number 6,797,367
- Issue date Sep 28, 2004
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing three-dimensional printed wiring board
- Patent number 6,499,217
- Issue date Dec 31, 2002
- Mitsubishi Plastics Inc.
- Shingetsu Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-resistant insulating film, raw substrate for printed wiring bo...
- Patent number 6,228,467
- Issue date May 8, 2001
- Mitsubishi Plastics, Inc.
- Kouichirou Taniguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Magneto-optical recording medium and method for production thereof
- Patent number 5,441,804
- Issue date Aug 15, 1995
- Mitsubishi Plastics Industries Limited
- Toshiyuki Akitake
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL SUBSTRATE AND LIGHT SOURCE DEVICE
- Publication number 20120138990
- Publication date Jun 7, 2012
- MITSUBISHI CHEMICAL CORPORATION
- Yoshihito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION
- Publication number 20110042124
- Publication date Feb 24, 2011
- Mitsubishi Plastics, Inc.
- Jun Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL LAMINATED BODY, LED-MOUNTED SUBSTRATE, AND WHITE FILM
- Publication number 20100301725
- Publication date Dec 2, 2010
- Jun Matsui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20090020319
- Publication date Jan 22, 2009
- MITSUBISHI PLASTICS INC
- Shingetsu Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Multilayer Wiring Board
- Publication number 20080116611
- Publication date May 22, 2008
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20050025944
- Publication date Feb 3, 2005
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Polyarlketone resin film and a laminate thereof with metal
- Publication number 20040096678
- Publication date May 20, 2004
- Kouichirou Taniguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20030180510
- Publication date Sep 25, 2003
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device built-in multilayer wiring board and method of...
- Publication number 20030178726
- Publication date Sep 25, 2003
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shingetsu Yamada

Person

Patents Grantslast 30 patents

Metal substrate and light source device

Metal laminated body, LED-mounted substrate, and white film

Multilayer printed circuit board

Method of manufacturing multilayer wiring board

Semiconductor device integrated multilayer wiring board

Heat resistant resin composition, a heat resistant film or sheet th...

Multilayer wiring board, semiconductor device mounting board using...

Method of manufacturing three-dimensional printed wiring board

Heat-resistant insulating film, raw substrate for printed wiring bo...

Magneto-optical recording medium and method for production thereof

Patents Applicationslast 30 patents

METAL SUBSTRATE AND LIGHT SOURCE DEVICE

MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION

METAL LAMINATED BODY, LED-MOUNTED SUBSTRATE, AND WHITE FILM

MULTILAYER PRINTED CIRCUIT BOARD

Method of Manufacturing Multilayer Wiring Board

Multilayer wiring board, semiconductor device mounting board using...

Polyarlketone resin film and a laminate thereof with metal

Multilayer wiring board, semiconductor device mounting board using...

Semiconductor device built-in multilayer wiring board and method of...