Shingo Ishida

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Kawasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for processing mold material and method for manufacturing st...
- Patent number 10,607,876
- Issue date Mar 31, 2020
- Tokyo Ohka Kogyo Co., Ltd.
- Yasushi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing laminate, and method of separating support
- Patent number 10,081,172
- Issue date Sep 25, 2018
- Tokyo Ohka Kogyo Co., Ltd.
- Shingo Ishida
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding method and bonding apparatus
- Patent number 9,962,915
- Issue date May 8, 2018
- Tokyo Ohka Kogyo Co., Ltd.
- Atsushi Miyanari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, laminate, and stripping method
- Patent number 9,881,829
- Issue date Jan 30, 2018
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, laminate, and stripping method
- Patent number 9,607,875
- Issue date Mar 28, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD
- Publication number 20170148659
- Publication date May 25, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro YOSHIOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF PREPARING LAMINATE, AND METHOD OF SEPARATING SUPPORT
- Publication number 20160343601
- Publication date Nov 24, 2016
- Tokyo Ohka Kogyo Co., Ltd.
- Shingo ISHIDA
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD
- Publication number 20150299534
- Publication date Oct 22, 2015
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro Yoshioka
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING METHOD AND BONDING APPARATUS
- Publication number 20140374017
- Publication date Dec 25, 2014
- Atsushi Miyanari
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PROCESSING MOLD MATERIAL AND METHOD FOR MANUFACTURING ST...
- Publication number 20140332149
- Publication date Nov 13, 2014
- Tokyo Ohka Kogyo Co., Ltd.
- Yasushi Fujii
- H01 - BASIC ELECTRIC ELEMENTS