Shingo NAKAMURA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,862,892
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Masaya Tazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having exposed clip top sides and methods of...
- Patent number 11,611,170
- Issue date Mar 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Masaya Tazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,367,664
- Issue date Jun 21, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,236,231
- Issue date Mar 19, 2019
- J-Devices Corporation
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,134,710
- Issue date Nov 20, 2018
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,601,450
- Issue date Mar 21, 2017
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 9,368,474
- Issue date Jun 14, 2016
- J-DEVICES CORPORATION
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240204444
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Masaya TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240194544
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230198193
- Publication date Jun 22, 2023
- Amkor Technology Singapore Holding Pte. Ltd
- Masaya TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220384284
- Publication date Dec 1, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220311168
- Publication date Sep 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Masaya TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220115301
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210265225
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210193539
- Publication date Jun 24, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Shojiro Hanada
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170301599
- Publication date Oct 19, 2017
- J-DEVICES CORPORATION
- Takeshi MIYAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170148766
- Publication date May 25, 2017
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20160079204
- Publication date Mar 17, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160027715
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150371934
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Hirokazu HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150279759
- Publication date Oct 1, 2015
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150243576
- Publication date Aug 27, 2015
- J-DEVICES CORPORATION
- Takeshi MIYAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Shingo NAKAMURA

Person

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor devices having exposed clip top sides and methods of...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Semiconductor package

Semiconductor package

Semiconductor package

Manufacturing method for semiconductor device

Heat sink in the aperture of substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE