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Shingo Watanabe
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Tsuchiura, JP
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last 30 patents
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Patent Grant
Nickel plating solution and its preparation method, nickel plating...
Patent number
7,842,397
Issue date
Nov 30, 2010
Hitachi Cable, Ltd.
Yasuyuki Ito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Copper foil for printed circuit board, method for fabricating same,...
Patent number
7,344,785
Issue date
Mar 18, 2008
Hitachi Cable, Ltd.
Muneo Kodaira
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
Nickel plating solution and its preparation method, nickel plating...
Publication number
20070071999
Publication date
Mar 29, 2007
Hitachi Cable, Ltd.
Yasuyuki Ito
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper foil for printed circuit board, method for fabricating same,...
Publication number
20060257680
Publication date
Nov 16, 2006
HITACHI CABLE, LTD.
Muneo Kodaira
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR