Shingo Yoshioka

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sheet-shaped stretchable structure, and resin composition for stret...
- Patent number 10,966,317
- Issue date Mar 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition and film using same
- Patent number 10,791,624
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Sawada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Prepreg, metal-clad laminated plate, wiring board, and method for m...
- Patent number 10,371,612
- Issue date Aug 6, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Keiko Kashihara
- G01 - MEASURING TESTING
Information Patent Grant
Sheet-shaped stretchable structure, and resin composition for stret...
- Patent number 10,299,379
- Issue date May 21, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive film, and touch panel, display, touch sensor, and solar...
- Patent number 10,109,390
- Issue date Oct 23, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Sawada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition and film using same
- Patent number 10,009,994
- Issue date Jun 26, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Sawada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrically conductive film
- Patent number 9,839,119
- Issue date Dec 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Sawada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structural member for electronic devices
- Patent number 9,802,397
- Issue date Oct 31, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 9,795,033
- Issue date Oct 17, 2017
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Resin composition, resin varnish, prepreg, metal-clad laminated boa...
- Patent number 9,736,935
- Issue date Aug 15, 2017
- Panasonic Corporation
- Hiroharu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of molded article
- Patent number 9,669,567
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsuyoshi Takeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin composition, resin varnish, prepreg, metal-clad laminated boa...
- Patent number 9,585,248
- Issue date Feb 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroharu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dry film for optical waveguides, optical waveguide using same, phot...
- Patent number 9,568,673
- Issue date Feb 14, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Junko Kurizoe
- G02 - OPTICS
Information Patent Grant
Metal-clad laminate and printed wiring board
- Patent number 9,480,148
- Issue date Oct 25, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroharu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive film
- Patent number 9,468,092
- Issue date Oct 11, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Sawada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board, and semiconductor device having component mounted on...
- Patent number 9,351,402
- Issue date May 24, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing multilayer circuit board
- Patent number 9,332,650
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components assembly
- Patent number 9,204,530
- Issue date Dec 1, 2015
- Panasonic Corporation
- Hiromitsu Takashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 9,175,151
- Issue date Nov 3, 2015
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring method, structure having wiring provided on surface, semicon...
- Patent number 9,082,635
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method for semiconductor package, semiconductor packa...
- Patent number 9,082,825
- Issue date Jul 14, 2015
- Panasonic Corporation
- Hiromitsu Takashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure for wiring formation
- Patent number 9,082,438
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board, and semiconductor device having component mounted on...
- Patent number 8,929,092
- Issue date Jan 6, 2015
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 8,901,728
- Issue date Dec 2, 2014
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 8,877,843
- Issue date Nov 4, 2014
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 8,759,148
- Issue date Jun 24, 2014
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of producing circuit board, and circuit board obtained using...
- Patent number 8,698,003
- Issue date Apr 15, 2014
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 8,482,137
- Issue date Jul 9, 2013
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...
- Publication number 20190110361
- Publication date Apr 11, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKATOSHI ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PREPREG, METAL-CLAD LAMINATED PLATE, WIRING BOARD, AND METHOD FOR M...
- Publication number 20180275031
- Publication date Sep 27, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- KEIKO KASHIHARA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION AND FILM USING SAME
- Publication number 20180263113
- Publication date Sep 13, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoaki SAWADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE FILM, AND TOUCH PANEL, DISPLAY, TOUCH SENSOR, AND SOLAR...
- Publication number 20170271043
- Publication date Sep 21, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- TOMOAKI SAWADA
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTORICALLY CONDUCTIVE FILM
- Publication number 20160266668
- Publication date Sep 15, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoaki SAWADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN COMPOSITION AND FILM USING SAME
- Publication number 20160264813
- Publication date Sep 15, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoaki SAWADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURAL MEMBER FOR ELECTRONIC DEVICES
- Publication number 20160152016
- Publication date Jun 2, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Takatoshi ABE
- B32 - LAYERED PRODUCTS
Information Patent Application
SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...
- Publication number 20160157343
- Publication date Jun 2, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- TAKATOSHI ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOA...
- Publication number 20160143135
- Publication date May 19, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroharu INOUE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DRY FILM FOR OPTICAL WAVEGUIDES, OPTICAL WAVEGUIDE USING SAME, PHOT...
- Publication number 20150370016
- Publication date Dec 24, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Junko KURIZOE
- G02 - OPTICS
Information Patent Application
ELECTORICALLY CONDUCTIVE FILM
- Publication number 20150373838
- Publication date Dec 24, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoaki SAWADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20150271924
- Publication date Sep 24, 2015
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20150156873
- Publication date Jun 4, 2015
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOA...
- Publication number 20150037589
- Publication date Feb 5, 2015
- PANASONIC CORPORATION
- Hiroharu INOUE
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF MOLDED ARTICLE
- Publication number 20150035202
- Publication date Feb 5, 2015
- PANASONIC CORPORATION
- Tsuyoshi TAKEDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD
- Publication number 20150034366
- Publication date Feb 5, 2015
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20150008379
- Publication date Jan 8, 2015
- PANASONIC CORPORATION
- Yuko Konno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...
- Publication number 20140191406
- Publication date Jul 10, 2014
- PANASONIC CORPORATION
- Hiromitsu Takashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140097004
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140090876
- Publication date Apr 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20130337188
- Publication date Dec 19, 2013
- PANASONIC CORPORATION
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20130319735
- Publication date Dec 5, 2013
- PANASONIC CORPORATION
- Hiroharu Inoue
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC COMPONENTS ASSEMBLY
- Publication number 20130265729
- Publication date Oct 10, 2013
- PANASONIC CORPORATION
- Hiromitsu TAKASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20130200522
- Publication date Aug 8, 2013
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20130056247
- Publication date Mar 7, 2013
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120292083
- Publication date Nov 22, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120285736
- Publication date Nov 15, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20120206891
- Publication date Aug 16, 2012
- Shingo Yoshioka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Shingo Yoshioka

Person

Patents Grantslast 30 patents

Sheet-shaped stretchable structure, and resin composition for stret...

Resin composition and film using same

Prepreg, metal-clad laminated plate, wiring board, and method for m...

Sheet-shaped stretchable structure, and resin composition for stret...

Conductive film, and touch panel, display, touch sensor, and solar...

Resin composition and film using same

Electrically conductive film

Structural member for electronic devices

Method of mounting semiconductor chips, semiconductor device obtain...

Resin composition, resin varnish, prepreg, metal-clad laminated boa...

Manufacturing method of molded article

Resin composition, resin varnish, prepreg, metal-clad laminated boa...

Dry film for optical waveguides, optical waveguide using same, phot...

Metal-clad laminate and printed wiring board

Electrically conductive film

Circuit board, and semiconductor device having component mounted on...

Method of producing multilayer circuit board

Circuit board

Electronic components assembly

Resin composition and method for producing circuit board

Wiring method, structure having wiring provided on surface, semicon...

Manufacturing method for semiconductor package, semiconductor packa...

Three-dimensional structure for wiring formation

Three-dimensional structure in which wiring is provided on its surface

Circuit board, and semiconductor device having component mounted on...

Method of mounting semiconductor chips, semiconductor device obtain...

Resin composition and method for producing circuit board

Method of mounting semiconductor chips, semiconductor device obtain...

Method of producing circuit board, and circuit board obtained using...

Method of mounting semiconductor chips, semiconductor device obtain...

Patents Applicationslast 30 patents

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...

PREPREG, METAL-CLAD LAMINATED PLATE, WIRING BOARD, AND METHOD FOR M...

RESIN COMPOSITION AND FILM USING SAME

CONDUCTIVE FILM, AND TOUCH PANEL, DISPLAY, TOUCH SENSOR, AND SOLAR...

ELECTORICALLY CONDUCTIVE FILM

RESIN COMPOSITION AND FILM USING SAME

STRUCTURAL MEMBER FOR ELECTRONIC DEVICES

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...

RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOA...

DRY FILM FOR OPTICAL WAVEGUIDES, OPTICAL WAVEGUIDE USING SAME, PHOT...

ELECTORICALLY CONDUCTIVE FILM

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...

RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOA...

MANUFACTURING METHOD OF MOLDED ARTICLE

CIRCUIT BOARD

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

ELECTRONIC COMPONENTS ASSEMBLY

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...