Shinichi Funaki

Person

Aizuwakamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper alloy, copper alloy plastic working material, component for...
- Patent number 12,203,158
- Issue date Jan 21, 2025
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and metho...
- Patent number 11,926,889
- Issue date Mar 12, 2024
- Mitsubishi Materials Corporation
- Kenji Morikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy sheet, copper alloy sheet with plating film, and metho...
- Patent number 11,920,228
- Issue date Mar 5, 2024
- Mitsubishi Materials Corporation
- Yoshiteru Akisaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connector
- Patent number 11,905,614
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and manuf...
- Patent number 11,795,525
- Issue date Oct 24, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy plate, plating film-attached copper alloy plate, and m...
- Patent number 11,781,234
- Issue date Oct 10, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin-plated copper terminal material and method of manufacturing the...
- Patent number 11,572,633
- Issue date Feb 7, 2023
- Mitsubishi Materials Corporation
- Fuyumi Mawatari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material for connectors and method for producing same
- Patent number 10,923,245
- Issue date Feb 16, 2021
- Mitsubishi Materials Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT F...
- Publication number 20250034679
- Publication date Jan 30, 2025
- MITSUBISHI MATERIALS CORPORATION
- Takanori KOBAYASHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...
- Publication number 20230313341
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20230250514
- Publication date Aug 10, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20230243018
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...
- Publication number 20230243020
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C21 - METALLURGY OF IRON
Information Patent Application
COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT F...
- Publication number 20230243019
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...
- Publication number 20230143481
- Publication date May 11, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kazuaki Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHO...
- Publication number 20230047984
- Publication date Feb 16, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiteru Akisaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20220380924
- Publication date Dec 1, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHO...
- Publication number 20220316028
- Publication date Oct 6, 2022
- MITSUBISHI MATERIALS CORPORATION
- Kenji Morikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...
- Publication number 20220145424
- Publication date May 12, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...
- Publication number 20220081738
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL AND METHOD OF MANUFACTURING THE...
- Publication number 20210108325
- Publication date Apr 15, 2021
- MITSUBISHI MATERIALS CORPORATION
- Fuyumi Mawatari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS AND METHOD FOR PRODUCING SAME
- Publication number 20190362865
- Publication date Nov 28, 2019
- Mitsubishi Shindoh Co., Ltd
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Shinichi Funaki

Person

Patents Grantslast 30 patents

Copper alloy, copper alloy plastic working material, component for...

Copper alloy plate, copper alloy plate with plating film, and metho...

Copper alloy sheet, copper alloy sheet with plating film, and metho...

Terminal material for connector

Copper alloy plate, copper alloy plate with plating film, and manuf...

Copper alloy plate, plating film-attached copper alloy plate, and m...

Tin-plated copper terminal material and method of manufacturing the...

Terminal material for connectors and method for producing same

Patents Applicationslast 30 patents

COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT F...

COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...

COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT F...

Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...

COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHO...

TERMINAL MATERIAL FOR CONNECTOR

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHO...

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...

COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...

TIN-PLATED COPPER TERMINAL MATERIAL AND METHOD OF MANUFACTURING THE...

TERMINAL MATERIAL FOR CONNECTORS AND METHOD FOR PRODUCING SAME