Shinichi HARA

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Nagano-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Magnet wire bonding method and bonding structure
- Patent number 11,253,947
- Issue date Feb 22, 2022
- TAMAGAWA SEIKI CO., LTD.
- Hiroshi Kushihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESOLVER-POSITIONING RESIN PIN PORTION STRUCTURE
- Publication number 20220266790
- Publication date Aug 25, 2022
- TAMAGAWA SEIKI CO., LTD.
- Shinichi HARA
- B60 - VEHICLES IN GENERAL
Information Patent Application
MAGNET WIRE BONDING METHOD AND BONDING STRUCTURE
- Publication number 20200061735
- Publication date Feb 27, 2020
- Tamagawa Seiki Co., Ltd.
- Hiroshi KUSHIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR