Shinichi Horiba

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising a gate electrode having an opening
- Patent number 8,729,642
- Issue date May 20, 2014
- Eiji Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,395,232
- Issue date Mar 12, 2013
- Elpida Memory, Inc.
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrode and method of fabricating the same
- Patent number 6,861,319
- Issue date Mar 1, 2005
- Elpida Memory, Inc.
- Akira Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 6,580,105
- Issue date Jun 17, 2003
- NEC Electronic Corporation
- Keisuke Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device which increases the capacity of a capacitor wi...
- Patent number 6,429,478
- Issue date Aug 6, 2002
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an SRAM with increased resistance length
- Patent number 6,150,228
- Issue date Nov 21, 2000
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with a conductor plug incl...
- Patent number 6,136,696
- Issue date Oct 24, 2000
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance ground wiring in a semiconductor device
- Patent number 6,071,785
- Issue date Jun 6, 2000
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device incorporating a stepped contact hole
- Patent number 5,952,724
- Issue date Sep 14, 1999
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring layer in a semiconductor device
- Patent number 5,846,878
- Issue date Dec 8, 1998
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance ground wiring in a semiconductor device
- Patent number 5,744,866
- Issue date Apr 28, 1998
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120018841
- Publication date Jan 26, 2012
- Elpida Memory, Inc.
- Eiji KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20110018066
- Publication date Jan 27, 2011
- Elpida Memory, Inc.
- Shinichi HORIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090189248
- Publication date Jul 30, 2009
- Elpida Memory, Inc.
- Eiji KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device and method for manufacturing same
- Publication number 20030173582
- Publication date Sep 18, 2003
- NEC Electronics Corp.
- Keisuke Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate electrode and method of fabricating the same
- Publication number 20030146457
- Publication date Aug 7, 2003
- Akira Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device which increases the capacity without deepening...
- Publication number 20020130343
- Publication date Sep 19, 2002
- NEC Corporation
- Shinichi Horiba
- H01 - BASIC ELECTRIC ELEMENTS

Shinichi Horiba

Person

Patents Grantslast 30 patents

Semiconductor device comprising a gate electrode having an opening

Semiconductor device and method of manufacturing the same

Gate electrode and method of fabricating the same

Solid-state imaging device

Semiconductor device which increases the capacity of a capacitor wi...

Method of manufacturing an SRAM with increased resistance length

Method of forming a semiconductor device with a conductor plug incl...

Low resistance ground wiring in a semiconductor device

Semiconductor device incorporating a stepped contact hole

Method of manufacturing a wiring layer in a semiconductor device

Low resistance ground wiring in a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Solid-state imaging device and method for manufacturing same

Gate electrode and method of fabricating the same

Semiconductor device which increases the capacity without deepening...