Shinichi Kobayashi

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Tokyo-To, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer printed-wiring board process for producing
- Patent number 6,378,199
- Issue date Apr 30, 2002
- Dai Nippon Printing Co., Ltd.
- Hiroto Yoshinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR