TREA

Shinichi Kumazawa

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method and apparatus for changing the data setting modes in a bondi...
    • Patent number 5,613,000
    • Issue date Mar 18, 1997
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • G05 - CONTROLLING REGULATING
  • Information Patent Grant

    Method and apparatus for inspecting bent portions in wire loops
    • Patent number 5,485,398
    • Issue date Jan 16, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,156,323
    • Issue date Oct 20, 1992
    • Kabushiki Kaisha Shinkawa
    • Shinichi Kumazawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,123,585
    • Issue date Jun 23, 1992
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of wire bonding
    • Patent number 4,932,584
    • Issue date Jun 12, 1990
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR