Shinichi Namioka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Protective sheet disposing method
- Patent number 11,298,928
- Issue date Apr 12, 2022
- Disco Corporation
- Takashi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waste fluid treatment apparatus
- Patent number 11,040,889
- Issue date Jun 22, 2021
- Disco Corporation
- Shinichi Namioka
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Grinding apparatus
- Patent number 9,314,895
- Issue date Apr 19, 2016
- Disco Corporation
- Takashi Mori
- B24 - GRINDING POLISHING
Information Patent Grant
Flip chip bonder
- Patent number 7,222,772
- Issue date May 29, 2007
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor chip
- Patent number 7,172,950
- Issue date Feb 6, 2007
- Kansai Paint Co., Ltd.
- Kouji Takezoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer protective device and semiconductor wafer treat...
- Patent number 6,943,045
- Issue date Sep 13, 2005
- Disco Corporation
- Masahiko Kitamura
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer support plate
- Patent number 6,927,416
- Issue date Aug 9, 2005
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing machine for cutting CSP plate into pellets
- Patent number 6,494,197
- Issue date Dec 17, 2002
- Disco Corporation
- Eiichi Yoshimura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
CSP plate holder
- Patent number 6,386,191
- Issue date May 14, 2002
- Disco Corporation
- Eiichi Yoshimura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chuck table
- Patent number 6,382,609
- Issue date May 7, 2002
- Disco Corporation
- Shinichi Namioka
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Cutting-and-transferring system and pellet transferring apparatus
- Patent number 6,341,740
- Issue date Jan 29, 2002
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of cutting and separating a bent board into individual small...
- Patent number 6,286,499
- Issue date Sep 11, 2001
- Disco Corporation
- Masahiro Yoshii
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
CSP plate cutting apparatus
- Patent number 6,250,990
- Issue date Jun 26, 2001
- Disco Corporation
- Masahiro Yoshii
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
WASTE FLUID TREATMENT APPARATUS
- Publication number 20200223713
- Publication date Jul 16, 2020
- Disco Corporation
- Shinichi NAMIOKA
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
PROTECTIVE SHEET DISPOSING METHOD
- Publication number 20190308399
- Publication date Oct 10, 2019
- Disco Corporation
- Takashi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GRINDING APPARATUS
- Publication number 20150158137
- Publication date Jun 11, 2015
- Disco Corporation
- Takashi Mori
- B24 - GRINDING POLISHING
Information Patent Application
Flip chip bonder
- Publication number 20040206800
- Publication date Oct 21, 2004
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Machine for processing electrodes formed on a plate-like workpiece
- Publication number 20040208718
- Publication date Oct 21, 2004
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20040192012
- Publication date Sep 30, 2004
- Kouji Takezoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support plate
- Publication number 20040124413
- Publication date Jul 1, 2004
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing a semiconductor wafer
- Publication number 20040092108
- Publication date May 13, 2004
- Kouichi Yajima
- B24 - GRINDING POLISHING
Information Patent Application
Cutting-and-transferring system and pellet transferring apparatus
- Publication number 20010040197
- Publication date Nov 15, 2001
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE

Shinichi Namioka

Person

Patents Grantslast 30 patents

Protective sheet disposing method

Waste fluid treatment apparatus

Grinding apparatus

Flip chip bonder

Method for manufacturing semiconductor chip

Semiconductor wafer protective device and semiconductor wafer treat...

Wafer support plate

Dicing machine for cutting CSP plate into pellets

CSP plate holder

Chuck table

Cutting-and-transferring system and pellet transferring apparatus

Method of cutting and separating a bent board into individual small...

CSP plate cutting apparatus

Patents Applicationslast 30 patents

WASTE FLUID TREATMENT APPARATUS

PROTECTIVE SHEET DISPOSING METHOD

GRINDING APPARATUS

Flip chip bonder

Machine for processing electrodes formed on a plate-like workpiece

Method for manufacturing semiconductor chip

Wafer support plate

Method of processing a semiconductor wafer

Cutting-and-transferring system and pellet transferring apparatus