Shinichi NIKAIDO

Person

Sakura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Socket contact terminal and semiconductor device
- Patent number 8,177,561
- Issue date May 15, 2012
- Fujikura Ltd.
- Yasuhiro Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket, method for manufacturing socket, and semiconductor device
- Patent number 8,137,113
- Issue date Mar 20, 2012
- Fujikura Ltd.
- Yasuhiro Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector and electronic component provided with same
- Patent number 8,109,768
- Issue date Feb 7, 2012
- Fujikura Ltd.
- Shinichi Nikaido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided connector with protrusions
- Patent number 7,887,336
- Issue date Feb 15, 2011
- Fujikura Ltd.
- Shinichi Nikaido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC socket and manufacturing method for the same
- Patent number 7,748,991
- Issue date Jul 6, 2010
- Fujikura Ltd.
- Shinichi Nikaido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection configuration for rigid substrates
- Patent number 7,642,466
- Issue date Jan 5, 2010
- Fujikura Ltd.
- Shinichi Nikaido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC socket and IC package mounting device
- Patent number 7,635,268
- Issue date Dec 22, 2009
- Fujikura Ltd.
- Shinichi Nikaido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid sensor including electrostatic capacitance sensor
- Patent number 7,337,681
- Issue date Mar 4, 2008
- Fujikura Ltd.
- Shinichi Nikaido
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PARTIALLY MULTILAYERED WIRING BOARD AND METHOD OF MANUFACTURING PAR...
- Publication number 20120222887
- Publication date Sep 6, 2012
- FUJIKURA LTD.
- Shinichi NIKAIDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED CONNECTOR
- Publication number 20100081342
- Publication date Apr 1, 2010
- FUJIKURA LTD.
- Shinichi NIKAIDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR AND ELECTRONIC COMPONENT PROVIDED WITH SAME
- Publication number 20100025096
- Publication date Feb 4, 2010
- FUJIKURA LTD.
- Shinichi Nikaido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET CONTACT TERMINAL AND SEMICONDUCTOR DEVICE
- Publication number 20090250256
- Publication date Oct 8, 2009
- FUJIKURA, LTD.
- Yasuhiro Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET, METHOD FOR MANUFACTURING SOCKET, AND SEMICONDUCTOR DEVICE
- Publication number 20090197437
- Publication date Aug 6, 2009
- Fujikura Ltd.
- Yasuhiro Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC SOCKET AND IC PACKAGE MOUNTING DEVICE
- Publication number 20080032521
- Publication date Feb 7, 2008
- FUJIKURA LTD.
- Shinichi NIKAIDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC SOCKET AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20080020624
- Publication date Jan 24, 2008
- FUJIKURA LTD.
- Shinichi NIKAIDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid sensor including electrostatic capacitance sensor
- Publication number 20050257628
- Publication date Nov 24, 2005
- FUJIKURA LTD.
- Shinichi Nikaido
- B60 - VEHICLES IN GENERAL

Shinichi NIKAIDO

Person

Patents Grantslast 30 patents

Socket contact terminal and semiconductor device

Socket, method for manufacturing socket, and semiconductor device

Connector and electronic component provided with same

Double-sided connector with protrusions

IC socket and manufacturing method for the same

Connection configuration for rigid substrates

IC socket and IC package mounting device

Hybrid sensor including electrostatic capacitance sensor

Patents Applicationslast 30 patents

PARTIALLY MULTILAYERED WIRING BOARD AND METHOD OF MANUFACTURING PAR...

DOUBLE-SIDED CONNECTOR

CONNECTOR AND ELECTRONIC COMPONENT PROVIDED WITH SAME

SOCKET CONTACT TERMINAL AND SEMICONDUCTOR DEVICE

SOCKET, METHOD FOR MANUFACTURING SOCKET, AND SEMICONDUCTOR DEVICE

IC SOCKET AND IC PACKAGE MOUNTING DEVICE

IC SOCKET AND MANUFACTURING METHOD FOR THE SAME

Hybrid sensor including electrostatic capacitance sensor