Shinichi Ogawa

Person

Neyagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,737,037
- Issue date Jun 15, 2010
- NEC Electronics Corporation
- Akira Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,566,976
- Issue date Jul 28, 2009
- Panasonic Corporation
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,339,270
- Issue date Mar 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,199,044
- Issue date Apr 3, 2007
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of observation by transmission electron microscopy
- Patent number 7,083,992
- Issue date Aug 1, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Ogawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,376,373
- Issue date Apr 23, 2002
- Matsushita Electronics Corporation
- Kikuko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 6,150,248
- Issue date Nov 21, 2000
- Matsushita Electronics Corporation
- Mitsuru Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,100,170
- Issue date Aug 8, 2000
- Matsushita Electronics Corporation
- Michikazu Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,852,328
- Issue date Dec 22, 1998
- Matsushita Electronics Corporation
- Hiroshi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum scandium alloy interconnection
- Patent number 5,804,879
- Issue date Sep 8, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum interconnection
- Patent number 5,759,868
- Issue date Jun 2, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 5,330,921
- Issue date Jul 19, 1994
- Matsushita Electric Industrial Co., Ltd.
- Takehito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100007022
- Publication date Jan 14, 2010
- Nobuaki Tarumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080293247
- Publication date Nov 27, 2008
- NEC ELECTRONICS CORPORATION
- Akira Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20080122112
- Publication date May 29, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20070032068
- Publication date Feb 8, 2007
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060115963
- Publication date Jun 1, 2006
- NEC ELECTRONICS CORPORATION
- Akira Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming inorganic porus film
- Publication number 20050181576
- Publication date Aug 18, 2005
- Semiconductor Leading Edge Technologies, Inc.
- Shinichi Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20050121786
- Publication date Jun 9, 2005
- Semiconductor Leading Edge Technologies, Inc.
- Akira Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of observation by transmission electron microscopy
- Publication number 20050042781
- Publication date Feb 24, 2005
- Semiconductor Leading Edge Technologies, Inc.
- Shinichi Ogawa
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20040259381
- Publication date Dec 23, 2004
- Semiconductor Leading Edge Technologies, Inc.
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS

Shinichi Ogawa

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Method for manufacturing semiconductor device

Method of observation by transmission electron microscopy

Method of manufacturing a semiconductor device

Method for fabricating semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Aluminum scandium alloy interconnection

Aluminum interconnection

Method of fabricating semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Method for forming inorganic porus film

Semiconductor device and its manufacturing method

Method of observation by transmission electron microscopy

Method for manufacturing semiconductor device