Shinichi Sugiura

Follow

Person

Kobe-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,318,426
- Issue date Apr 19, 2016
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,420,444
- Issue date Apr 16, 2013
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus
- Patent number 7,308,999
- Issue date Dec 18, 2007
- Fujitsu Ten Limited
- Toshihiko Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 7,120,024
- Issue date Oct 10, 2006
- Fujitsu Ten Limited
- Hiromichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure
- Patent number 6,750,537
- Issue date Jun 15, 2004
- Fujitsu Ten Limited
- Hideaki Kaino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus
- Patent number 6,708,862
- Issue date Mar 23, 2004
- Fujitsu Ten Limited
- Toshihiko Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130187271
- Publication date Jul 25, 2013
- FUJITSU TEN LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110233765
- Publication date Sep 29, 2011
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR
- Publication number 20080303147
- Publication date Dec 11, 2008
- FUJITSU TEN LIMITED
- Hiromichi WATANABE
- G01 - MEASURING TESTING
Information Patent Application
Electronic control device
- Publication number 20050190539
- Publication date Sep 1, 2005
- Hiromichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die bonding apparatus
- Publication number 20040129758
- Publication date Jul 8, 2004
- FUJITSU TEN LIMITED
- Toshihiko Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die bonding apparatus
- Publication number 20030024963
- Publication date Feb 6, 2003
- FUJITSU TEN LIMITED
- Toshihiko Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate structure
- Publication number 20020063325
- Publication date May 30, 2002
- FUJITSU TEN LIMITED
- Hideaki Kaino
- H01 - BASIC ELECTRIC ELEMENTS