Shinichi Terashima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Stainless steel foil and method of production of same
- Patent number 11,198,918
- Issue date Dec 14, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Hiroto Unno
- C21 - METALLURGY OF IRON
Information Patent Grant
Cu pillar cylindrical preform for semiconductor connection
- Patent number 11,101,234
- Issue date Aug 24, 2021
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for base material and producing method thereof
- Patent number 9,902,134
- Issue date Feb 27, 2018
- Nippon Steel & Sumikin Materials Co., Ltd.
- Takayuki Kobayashi
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Copper alloy bonding wire for semiconductor
- Patent number 9,427,830
- Issue date Aug 30, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball and electronic member
- Patent number 9,320,152
- Issue date Apr 19, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for base material
- Patent number 9,296,180
- Issue date Mar 29, 2016
- NIPPON STELL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball for semiconductor packaging and electronic member using...
- Patent number 9,024,442
- Issue date May 5, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder bump bonding structure
- Patent number 8,847,390
- Issue date Sep 30, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Eiji Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,815,019
- Issue date Aug 26, 2014
- Nippon Steel & Sumikin Materials., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,742,258
- Issue date Jun 3, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mounting bonding wire
- Patent number 8,097,960
- Issue date Jan 17, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device and method for producing the...
- Patent number 7,969,021
- Issue date Jun 28, 2011
- Nippon Steel Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold bonding wires for semiconductor devices and method of producin...
- Patent number 7,390,370
- Issue date Jun 24, 2008
- Nippon Steel Corporation
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Brake system
- Patent number 7,124,858
- Issue date Oct 24, 2006
- Akebono Brake Industry Co., Ltd.
- Hiroshi Ikegami
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
FE-BASED AMORPHOUS ALLOY AND FE-BASED AMORPHOUS ALLOY RIBBON
- Publication number 20240229206
- Publication date Jul 11, 2024
- NIPPON STEEL CORPORATION
- Shinya SATO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POWER-GENERATING MAGNETOSTRICTIVE ELEMENT AND MAGNETOSTRICTIVE POWE...
- Publication number 20240030837
- Publication date Jan 25, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Hiroaki SAKAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
- Publication number 20170287861
- Publication date Oct 5, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER BUMP JOINING STRUCTURE
- Publication number 20170259366
- Publication date Sep 14, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinji ISHIKAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER BALL AND ELECTRONIC MEMBER
- Publication number 20170209964
- Publication date Jul 27, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi TERASHIMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STAINLESS STEEL FOIL AND METHOD OF PRODUCTION OF SAME
- Publication number 20170009312
- Publication date Jan 12, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Hiroto UNNO
- B32 - LAYERED PRODUCTS
Information Patent Application
SOLDER BALL AND ELECTRONIC MEMBER
- Publication number 20150146394
- Publication date May 28, 2015
- NIPPON STEEL & SUMKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POLYIMIDE LAYER-CONTAINING FLEXIBLE SUBSTRATE, POLYIMIDE LAYER-CONT...
- Publication number 20150136209
- Publication date May 21, 2015
- NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
- Kouichi Hattori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
- Publication number 20140054766
- Publication date Feb 27, 2014
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Eiji HASHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METAL FOIL FOR BASE MATERIAL AND PRODUCING METHOD THEREOF
- Publication number 20130236734
- Publication date Sep 12, 2013
- Takayuki Kobayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL FOIL FOR BASE MATERIAL
- Publication number 20130236737
- Publication date Sep 12, 2013
- Shinichi Terashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING...
- Publication number 20120223430
- Publication date Sep 6, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120118610
- Publication date May 17, 2012
- NIPPON MICROMETAL CORPORATION
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120094121
- Publication date Apr 19, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISI...
- Publication number 20120038042
- Publication date Feb 16, 2012
- NIPPON MICROMETAL CORPORATION
- Tsutomu Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20110120594
- Publication date May 26, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOUNTING BONDING WIRE
- Publication number 20090072399
- Publication date Mar 19, 2009
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold alloy bonding wire for semiconductor device and process for pr...
- Publication number 20050079347
- Publication date Apr 14, 2005
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Brake operating apparatus
- Publication number 20050000755
- Publication date Jan 6, 2005
- Akebono Brake Industry Co., Ltd
- Hiroshi Ikegami
- B60 - VEHICLES IN GENERAL
Information Patent Application
Brake system
- Publication number 20040144600
- Publication date Jul 29, 2004
- Hiroshi Ikegami
- B60 - VEHICLES IN GENERAL
Information Patent Application
Bonding wire for semiconductor and method of manufacturing the bond...
- Publication number 20040014266
- Publication date Jan 22, 2004
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS

Shinichi Terashima

Person

Patents Grantslast 30 patents

Stainless steel foil and method of production of same

Cu pillar cylindrical preform for semiconductor connection

Metal foil for base material and producing method thereof

Copper alloy bonding wire for semiconductor

Solder ball and electronic member

Metal foil for base material

Bonding wire for semiconductor device

Solder ball for semiconductor packaging and electronic member using...

Lead-free solder bump bonding structure

Bonding wire for semiconductor

Bonding wire for semiconductor

Wire bonding structure and method for forming same

Semiconductor device bonding wire and wire bonding method

Semiconductor mounting bonding wire

Bonding wire for semiconductor device and method for producing the...

Gold bonding wires for semiconductor devices and method of producin...

Brake system

Patents Applicationslast 30 patents

FE-BASED AMORPHOUS ALLOY AND FE-BASED AMORPHOUS ALLOY RIBBON

POWER-GENERATING MAGNETOSTRICTIVE ELEMENT AND MAGNETOSTRICTIVE POWE...

Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION

LEAD-FREE SOLDER BUMP JOINING STRUCTURE

SOLDER BALL AND ELECTRONIC MEMBER

STAINLESS STEEL FOIL AND METHOD OF PRODUCTION OF SAME

SOLDER BALL AND ELECTRONIC MEMBER

POLYIMIDE LAYER-CONTAINING FLEXIBLE SUBSTRATE, POLYIMIDE LAYER-CONT...

LEAD-FREE SOLDER BUMP BONDING STRUCTURE

BONDING WIRE FOR SEMICONDUCTOR

METAL FOIL FOR BASE MATERIAL AND PRODUCING METHOD THEREOF

METAL FOIL FOR BASE MATERIAL

SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING...

BONDING WIRE FOR SEMICONDUCTOR

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR

LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISI...

BONDING WIRE FOR SEMICONDUCTOR

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME

SEMICONDUCTOR MOUNTING BONDING WIRE

Gold alloy bonding wire for semiconductor device and process for pr...

Brake operating apparatus

Brake system

Bonding wire for semiconductor and method of manufacturing the bond...

Semiconductor device and method to produce the same