Shinichi TOMITA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Charged particle beam device and installation method
- Patent number 10,008,361
- Issue date Jun 26, 2018
- Hitachi High-Technologies Corporation
- Shuhei Yabu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle beam device
- Patent number 9,287,083
- Issue date Mar 15, 2016
- Hitachi High-Technologies Corporation
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle beam apparatus
- Patent number 9,058,957
- Issue date Jun 16, 2015
- Hitachi High-Technologies Corporation
- Kunji Shigeto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged-particle radiation apparatus
- Patent number 9,053,902
- Issue date Jun 9, 2015
- Hitachi High-Technologies Corporation
- Yuta Ebine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle beam apparatus
- Patent number 8,143,573
- Issue date Mar 27, 2012
- Hitachi High-Technologies Corporation
- Sukehiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning electron microscope
- Patent number 8,097,848
- Issue date Jan 17, 2012
- Hitachi High-Technologies Corporation
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle beam apparatus and method for charged particle bea...
- Patent number 8,026,491
- Issue date Sep 27, 2011
- Hitachi High-Technologies Corporation
- Takeshi Ogashiwa
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing silicon wafer
- Patent number 7,902,039
- Issue date Mar 8, 2011
- Sumco Corporation
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing silicon wafer
- Patent number 7,781,313
- Issue date Aug 24, 2010
- Sumco Corporation
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning electron microscope
- Patent number 7,755,045
- Issue date Jul 13, 2010
- Hitachi High-Technologies Corporation
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...
- Patent number 7,528,049
- Issue date May 5, 2009
- Sumco Corporation
- Yasunobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning electron microscope
- Patent number 7,511,271
- Issue date Mar 31, 2009
- Hitachi Science Systems, Ltd.
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded SOI substrate, and method for manufacturing the same
- Patent number 7,442,992
- Issue date Oct 28, 2008
- Sumco Corporation
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrate, method of manufacturing the substrate, and waf...
- Patent number 7,378,332
- Issue date May 27, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Shinichi Tomita
- B24 - GRINDING POLISHING
Information Patent Grant
SOI substrate and manufacturing method thereof
- Patent number 7,208,058
- Issue date Apr 24, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 6,620,285
- Issue date Sep 16, 2003
- Sumitomo Metal Industries
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHARGED PARTICLE BEAM DEVICE AND INSTALLATION METHOD
- Publication number 20170169988
- Publication date Jun 15, 2017
- Shuhei YABU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED-PARTICLE RADIATION APPARATUS
- Publication number 20140284477
- Publication date Sep 25, 2014
- Yuta Ebine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED PARTICLE BEAM APPARATUS
- Publication number 20140131590
- Publication date May 15, 2014
- Kunji Shigeto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED PARTICLE BEAM DEVICE
- Publication number 20130299715
- Publication date Nov 14, 2013
- Hitachi High-Technologies Corporation
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCANNING ELECTRON MICROSCOPE
- Publication number 20100090109
- Publication date Apr 15, 2010
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing silicon wafer
- Publication number 20090325385
- Publication date Dec 31, 2009
- SUMCO CORPORATION
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED PARTICLE BEAM APPARATUS
- Publication number 20090322973
- Publication date Dec 31, 2009
- Hitachi High-Technologies Corporation
- Sukehiro ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCANNING ELECTRON MICROSCOPE
- Publication number 20090230304
- Publication date Sep 17, 2009
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SOI SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090093106
- Publication date Apr 9, 2009
- SUMCO CORPORATION
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SILICON WAFER
- Publication number 20080132032
- Publication date Jun 5, 2008
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scanning Electron Microscope
- Publication number 20080035843
- Publication date Feb 14, 2008
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...
- Publication number 20080020541
- Publication date Jan 24, 2008
- Yasunobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charged particle beam apparatus and method for charged particle bea...
- Publication number 20070284542
- Publication date Dec 13, 2007
- Takeshi Ogashiwa
- G01 - MEASURING TESTING
Information Patent Application
Scanning electron microscope
- Publication number 20060186337
- Publication date Aug 24, 2006
- Michio Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded SOI substrate, and method for manufacturing the same
- Publication number 20060055003
- Publication date Mar 16, 2006
- SUMCO CORPORATION
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated substrate, method of manufacturing the substrate, and waf...
- Publication number 20050014347
- Publication date Jan 20, 2005
- Shinichi Tomita
- B24 - GRINDING POLISHING
Information Patent Application
SOI substrate and manufacturing method thereof
- Publication number 20040246795
- Publication date Dec 9, 2004
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for separating composite substrate
- Publication number 20040137697
- Publication date Jul 15, 2004
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding substrates
- Publication number 20020040754
- Publication date Apr 11, 2002
- Shinichi Tomita
- B32 - LAYERED PRODUCTS

Shinichi TOMITA

Person

Patents Grantslast 30 patents

Charged particle beam device and installation method

Charged particle beam device

Charged particle beam apparatus

Charged-particle radiation apparatus

Charged particle beam apparatus

Scanning electron microscope

Charged particle beam apparatus and method for charged particle bea...

Method for manufacturing silicon wafer

Method for manufacturing silicon wafer

Scanning electron microscope

Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...

Scanning electron microscope

Bonded SOI substrate, and method for manufacturing the same

Laminated substrate, method of manufacturing the substrate, and waf...

SOI substrate and manufacturing method thereof

Method for bonding substrates

Patents Applicationslast 30 patents

CHARGED PARTICLE BEAM DEVICE AND INSTALLATION METHOD

CHARGED-PARTICLE RADIATION APPARATUS

CHARGED PARTICLE BEAM APPARATUS

CHARGED PARTICLE BEAM DEVICE

SCANNING ELECTRON MICROSCOPE

Method for manufacturing silicon wafer

CHARGED PARTICLE BEAM APPARATUS

SCANNING ELECTRON MICROSCOPE

BONDED SOI SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SILICON WAFER

Scanning Electron Microscope

Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...

Charged particle beam apparatus and method for charged particle bea...

Scanning electron microscope

Bonded SOI substrate, and method for manufacturing the same

Laminated substrate, method of manufacturing the substrate, and waf...

SOI substrate and manufacturing method thereof

Method and apparatus for separating composite substrate

Method for bonding substrates