Shinichi Tomizawa

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Annaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating bonded wafer
- Patent number 7,531,425
- Issue date May 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonding wafer
- Patent number 6,884,696
- Issue date Apr 26, 2005
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer producing method and bonded wafer
- Patent number 6,797,632
- Issue date Sep 28, 2004
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Production method for silicon wafer and soi wafer, and soi wafer
- Publication number 20050020030
- Publication date Jan 27, 2005
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonding wafer
- Publication number 20030181001
- Publication date Sep 25, 2003
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS