Shinichi YAMAUCHI

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded body and method for manufacturing same
- Patent number 12,030,125
- Issue date Jul 9, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding composition, conductor bonding structure, and method for pr...
- Patent number 11,931,808
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper foil, negative electrode current collector and negative elec...
- Patent number 10,396,363
- Issue date Aug 27, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Koichi Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding junction structure
- Patent number 10,340,154
- Issue date Jul 2, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoichi Kamikoriyama
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...
- Publication number 20240181528
- Publication date Jun 6, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, A...
- Publication number 20240116104
- Publication date Apr 11, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi KONNO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING BONDING COMPOSITION
- Publication number 20230137716
- Publication date May 4, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDED BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20220139865
- Publication date May 5, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR PRESSURE BONDING, AND BONDED STRUCTURE OF CONDUCTIV...
- Publication number 20220118546
- Publication date Apr 21, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...
- Publication number 20210138541
- Publication date May 13, 2021
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING JUNCTION STRUCTURE
- Publication number 20180269074
- Publication date Sep 20, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Yoichi KAMIKORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR CONNECTION STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTI...
- Publication number 20170140847
- Publication date May 18, 2017
- Mitsui Mining and Smelting Co., Ltd.
- Yoichi KAMIKORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FOIL, NEGATIVE ELECTRODE CURRENT COLLECTOR AND NEGATIVE ELEC...
- Publication number 20150132658
- Publication date May 14, 2015
- Mitsui Mining and Smelting Co., Ltd.
- Koichi Miyake
- H01 - BASIC ELECTRIC ELEMENTS

Shinichi YAMAUCHI

Person

Patents Grantslast 30 patents

Bonded body and method for manufacturing same

Bonding composition, conductor bonding structure, and method for pr...

Copper foil, negative electrode current collector and negative elec...

Bonding junction structure

Patents Applicationslast 30 patents

BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...

JOINT STRUCTURE

CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, A...

METHOD FOR PRODUCING BONDING COMPOSITION

BONDED BODY AND METHOD FOR MANUFACTURING SAME

COMPOSITION FOR PRESSURE BONDING, AND BONDED STRUCTURE OF CONDUCTIV...

BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...

BONDING JUNCTION STRUCTURE

CONDUCTOR CONNECTION STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTI...

COPPER FOIL, NEGATIVE ELECTRODE CURRENT COLLECTOR AND NEGATIVE ELEC...