Shinitsu Takehashi

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,930,599
- Issue date Jul 27, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing said semiconductor device
- Patent number 5,783,463
- Issue date Jul 21, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having offsetchips
- Patent number 5,773,896
- Issue date Jun 30, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing said semiconductor device
- Patent number 5,640,044
- Issue date Jun 17, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding lead with electrode of electronic device
- Patent number 5,316,204
- Issue date May 31, 1994
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR