Shinji Ishitani

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded structure and bonding material
- Patent number 11,515,281
- Issue date Nov 29, 2022
- Panasonic Holdings Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal microparticle production method and metal microparticle produ...
- Patent number 11,318,534
- Issue date May 3, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akio Furusawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component
- Patent number 11,011,319
- Issue date May 18, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinji Ishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining apparatus with UV cleaning
- Patent number 8,240,539
- Issue date Aug 14, 2012
- Panasonic Corporation
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light emitting device and semiconductor light emittin...
- Patent number 8,129,739
- Issue date Mar 6, 2012
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element package and method of manufacturing the same
- Patent number 8,077,447
- Issue date Dec 13, 2011
- Panasonic Corporation
- Kazushi Higashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged electronic element and method of producing electronic elem...
- Patent number 7,692,292
- Issue date Apr 6, 2010
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,646,095
- Issue date Jan 12, 2010
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting element, manufacturing method and moun...
- Patent number 7,554,126
- Issue date Jun 30, 2009
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast atom bombardment source, fast atom beam emission method, and s...
- Patent number 7,550,715
- Issue date Jun 23, 2009
- Panasonic Corporation
- Takashi Omura
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDED STRUCTURE
- Publication number 20250121461
- Publication date Apr 17, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- YUMI TAKAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING STRUCTURE
- Publication number 20250108463
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
- Publication number 20200335470
- Publication date Oct 22, 2020
- PANASONIC CORPORATION
- Akio FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL MICROPARTICLE PRODUCTION METHOD AND METAL MICROPARTICLE PRODU...
- Publication number 20200130064
- Publication date Apr 30, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- AKIO FURUSAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190333707
- Publication date Oct 31, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- SHINJI ISHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL
- Publication number 20170341188
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- SHINJI ISHITANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor light emitting device and semiconductor light emittin...
- Publication number 20100012965
- Publication date Jan 21, 2010
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080137270
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fast atom bombardment source, fast atom beam emission method, and s...
- Publication number 20070284539
- Publication date Dec 13, 2007
- Takashi Omura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Light-Emitting Element, Manufacturing Method and Moun...
- Publication number 20070262338
- Publication date Nov 15, 2007
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged electronic element and method of producing electronic elem...
- Publication number 20070108634
- Publication date May 17, 2007
- Kazushi Higashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Joining apparatus and method
- Publication number 20060037997
- Publication date Feb 23, 2006
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050104173
- Publication date May 19, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Shinji Ishitani

Person

Patents Grantslast 30 patents

Bonded structure and bonding material

Metal microparticle production method and metal microparticle produ...

Electronic component

Joining apparatus with UV cleaning

Semiconductor light emitting device and semiconductor light emittin...

Electronic element package and method of manufacturing the same

Packaged electronic element and method of producing electronic elem...

Semiconductor device

Semiconductor light-emitting element, manufacturing method and moun...

Fast atom bombardment source, fast atom beam emission method, and s...

Patents Applicationslast 30 patents

BONDING MATERIAL AND BONDED STRUCTURE

BONDING MATERIAL AND BONDING STRUCTURE

BONDED STRUCTURE AND BONDING MATERIAL

METAL MICROPARTICLE PRODUCTION METHOD AND METAL MICROPARTICLE PRODU...

ELECTRONIC COMPONENT

SOLDER MATERIAL

Semiconductor light emitting device and semiconductor light emittin...

ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Fast atom bombardment source, fast atom beam emission method, and s...

Semiconductor Light-Emitting Element, Manufacturing Method and Moun...

Packaged electronic element and method of producing electronic elem...

Joining apparatus and method

Semiconductor device and manufacturing method thereof