Shinji Maekawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 11,810,820
- Issue date Nov 7, 2023
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 11,373,906
- Issue date Jun 28, 2022
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,153,471
- Issue date Oct 19, 2021
- Dai Nippon Printing Co., Ltd.
- Yoshiaki Tsuruoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 10,957,592
- Issue date Mar 23, 2021
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and manufacturing method thereof
- Patent number 10,755,996
- Issue date Aug 25, 2020
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module including a light-transmissive interposer subst...
- Patent number 10,681,256
- Issue date Jun 9, 2020
- Dai Nippon Printing Co., Ltd.
- Yoshiaki Tsuruoka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Evaluation substrate, defect examination method and defect detectio...
- Patent number 9,176,073
- Issue date Nov 3, 2015
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- G01 - MEASURING TESTING
Information Patent Grant
High impact resistant acceleration sensor
- Patent number 8,997,570
- Issue date Apr 7, 2015
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a through hole electrode substrate
- Patent number 8,637,397
- Issue date Jan 28, 2014
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezoelectric mirror device, optical equipment incorporating the sa...
- Patent number 8,570,630
- Issue date Oct 29, 2013
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fabrication process for a piezoelectric mirror device
- Patent number 8,539,655
- Issue date Sep 24, 2013
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Piezoelectric mirror device, optical equipment incorporating the sa...
- Patent number 8,300,290
- Issue date Oct 30, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through hole electrode substrate with different area weighted avera...
- Patent number 8,288,772
- Issue date Oct 16, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acceleration sensor resistant to excessive force breakage
- Patent number 8,132,458
- Issue date Mar 13, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20250014979
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20220328353
- Publication date Oct 13, 2022
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20220028772
- Publication date Jan 27, 2022
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20210175121
- Publication date Jun 10, 2021
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200259980
- Publication date Aug 13, 2020
- DAI NIPPON PRINTING CO., LTD.
- Yoshiaki TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20190287853
- Publication date Sep 19, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE, SEMICONDUCTOR DEVICE USING THE TH...
- Publication number 20190273038
- Publication date Sep 5, 2019
- DAI NIPPON PRINTING CO., LTD.
- Hiromasa NAGANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20190259696
- Publication date Aug 22, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20190080977
- Publication date Mar 14, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20180205858
- Publication date Jul 19, 2018
- DAI NIPPON PRINTING CO., LTD.
- Yoshiaki TSURUOKA
- G02 - OPTICS
Information Patent Application
EVALUATION SUBSTRATE, DEFECT EXAMINATION METHOD AND DEFECT DETECTIO...
- Publication number 20130258330
- Publication date Oct 3, 2013
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING A THROUGH HOLE ELECTRODE SUBSTRATE
- Publication number 20120329276
- Publication date Dec 27, 2012
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MIRROR DEVICE, OPTICAL EQUIPMENT INCORPORATING THE SA...
- Publication number 20120200903
- Publication date Aug 9, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji MAEKAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACCELERATION SENSOR
- Publication number 20120024065
- Publication date Feb 2, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji MAEKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MIRROR DEVICE, OPTICAL EQUIPMENT INCORPORATING THE SA...
- Publication number 20110179614
- Publication date Jul 28, 2011
- Dai Nippon Printing Co., Ltd.
- Shinji MAEKAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THROUGH HOLE ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING THE THRO...
- Publication number 20110062594
- Publication date Mar 17, 2011
- DAI NIPPON PRINTING, CO., LTD.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCELERATION SENSOR
- Publication number 20090282918
- Publication date Nov 19, 2009
- Dai Nippon Printing Co., Ltd.
- Shinji MAEKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MIRROR DEVICE, OPTICAL DEVICE USING THE PIEZOELECTRIC...
- Publication number 20090284818
- Publication date Nov 19, 2009
- DAI NIPPON PRINTING CO., LTD.
- Shinji Maekawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Shinji Maekawa

Person

Patents Grantslast 30 patents

Through electrode substrate and mounting substrate

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate, method of manufacturing through electr...

Through-hole electrode substrate

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate and manufacturing method thereof

Image sensor module including a light-transmissive interposer subst...

Evaluation substrate, defect examination method and defect detectio...

High impact resistant acceleration sensor

Method for manufacturing a through hole electrode substrate

Piezoelectric mirror device, optical equipment incorporating the sa...

Fabrication process for a piezoelectric mirror device

Piezoelectric mirror device, optical equipment incorporating the sa...

Through hole electrode substrate with different area weighted avera...

Acceleration sensor resistant to excessive force breakage

Patents Applicationslast 30 patents

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH-HOLE ELECTRODE SUBSTRATE, SEMICONDUCTOR DEVICE USING THE TH...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR MODULE

EVALUATION SUBSTRATE, DEFECT EXAMINATION METHOD AND DEFECT DETECTIO...

METHOD FOR MANUFACTURING A THROUGH HOLE ELECTRODE SUBSTRATE

PIEZOELECTRIC MIRROR DEVICE, OPTICAL EQUIPMENT INCORPORATING THE SA...

ACCELERATION SENSOR

PIEZOELECTRIC MIRROR DEVICE, OPTICAL EQUIPMENT INCORPORATING THE SA...

THROUGH HOLE ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING THE THRO...

ACCELERATION SENSOR

PIEZOELECTRIC MIRROR DEVICE, OPTICAL DEVICE USING THE PIEZOELECTRIC...