Shinji MORIMOTO

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of flexible printed wiring board
- Patent number 7,543,376
- Issue date Jun 9, 2009
- Panasonic Corporation
- Toyokazu Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board and manufacturing method thereof
- Patent number 7,427,717
- Issue date Sep 23, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shinji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered flexible print circuit board and manufacturing method...
- Patent number 7,263,769
- Issue date Sep 4, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shinji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts mounting method employing memory equipped parts su...
- Patent number 5,713,125
- Issue date Feb 3, 1998
- Matsushita Electric Industrial Co., Ltd.
- Nobuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts mounting apparatus having memory equipped parts su...
- Patent number 5,400,497
- Issue date Mar 28, 1995
- Matsushita Electric Industrial Co., Ltd.
- Nobuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parts supply device, parts supply method, parts managing system, an...
- Patent number 5,235,164
- Issue date Aug 10, 1993
- Matsushita Electric Industrial Co., Ltd.
- Takashi Noyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGHLY REFLECTIVE WHITE MATERIAL AND LED PACKAGE
- Publication number 20110242818
- Publication date Oct 6, 2011
- PANASONIC CORPORATION
- Masaaki ARITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090145651
- Publication date Jun 11, 2009
- PANASONIC CORPORATION
- Toyokazu YOSHINO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-LAYERED FLEXIBLE PRINT CIRCUIT BOARD AND MANUFACTURING METHOD...
- Publication number 20070148829
- Publication date Jun 28, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toyokazu YOSHINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLAYER CONNECTION CONDUCTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20060272850
- Publication date Dec 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinji MORIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered flexible print circuit board and manufacturing method...
- Publication number 20060102386
- Publication date May 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible printed wiring board and manufacturing method thereof
- Publication number 20050257952
- Publication date Nov 24, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shinji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shinji MORIMOTO

Person

Patents Grantslast 30 patents

Manufacturing method of flexible printed wiring board

Flexible printed wiring board and manufacturing method thereof

Multi-layered flexible print circuit board and manufacturing method...

Electronic parts mounting method employing memory equipped parts su...

Electronic parts mounting apparatus having memory equipped parts su...

Parts supply device, parts supply method, parts managing system, an...

Patents Applicationslast 30 patents

HIGHLY REFLECTIVE WHITE MATERIAL AND LED PACKAGE

MULTILAYER WIRING BOARD AND METHOD FOR PRODUCING THE SAME

MULTI-LAYERED FLEXIBLE PRINT CIRCUIT BOARD AND MANUFACTURING METHOD...

INTERLAYER CONNECTION CONDUCTOR AND MANUFACTURING METHOD THEREOF

Multi-layered flexible print circuit board and manufacturing method...

Flexible printed wiring board and manufacturing method thereof