Shinji Nagatsuka

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Mitaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Abnormality transmission system for wire saw
- Patent number 6,234,160
- Issue date May 22, 2001
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw control method and wire saw
- Patent number 6,178,961
- Issue date Jan 30, 2001
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw and slicing method thereof
- Patent number 5,904,136
- Issue date May 18, 1999
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing semiconductor wafer and system therefor
- Patent number 5,427,644
- Issue date Jun 27, 1995
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE