Shinji Ohsawa

Person

Yamaguchi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Hydrogen separation membrane with a carrier, fuel cell and hydrogen...
- Patent number 9,017,757
- Issue date Apr 28, 2015
- Toyota Jidosha Kabushiki Kaisha
- Satoshi Aoyama
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 8,138,423
- Issue date Mar 20, 2012
- Toyo Kohan Co., Ltd.
- Mitsuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 7,284,320
- Issue date Oct 23, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered metal laminate and process for producing the same
- Patent number 7,175,919
- Issue date Feb 13, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas separating unit and method for manufacturing the same
- Patent number 7,033,641
- Issue date Apr 25, 2006
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Clad plate for forming interposer for semiconductor device, interpo...
- Patent number 6,949,412
- Issue date Sep 27, 2005
- Toyo Kohan Co.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, metal laminated plate for fabricating circuit...
- Patent number 6,841,877
- Issue date Jan 11, 2005
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clad plate for forming interposer for semiconductor device, interpo...
- Patent number 6,838,318
- Issue date Jan 4, 2005
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clad board for printed-circuit board, multilayered printed-circuit...
- Patent number 6,730,391
- Issue date May 4, 2004
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing metal foil/ceramics joining material and me...
- Patent number 6,689,482
- Issue date Feb 10, 2004
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clad sheet for printed circuit board, a multilayered printed circui...
- Patent number 6,579,565
- Issue date Jun 17, 2003
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Hydrogen Separation Membrane with a Carrier, Fuel Cell and Hydrogen...
- Publication number 20100047648
- Publication date Feb 25, 2010
- Toyota Jidosha Kabushiki Kaisha
- Satoshi Aoyama
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Printed wiring board and method for manufacturing printed wiring board
- Publication number 20090145630
- Publication date Jun 11, 2009
- MULTI INC.
- Mitsuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered metal laminate and process for producing the same
- Publication number 20060163329
- Publication date Jul 27, 2006
- TOYO KOHAN CO., LTD
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20050193555
- Publication date Sep 8, 2005
- TOYO KOHAN CO., LTD
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic circuit device and porduction method therefor
- Publication number 20050082669
- Publication date Apr 21, 2005
- Kinji Saijo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Gas separating unit and method for manufacturing the same
- Publication number 20050076779
- Publication date Apr 14, 2005
- Kinji Saijo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
High polymer plate and conductive plate connecting body, and part u...
- Publication number 20040175583
- Publication date Sep 9, 2004
- Kinji Saijo
- B32 - LAYERED PRODUCTS
Information Patent Application
Hollow laminate and heat sink using the same
- Publication number 20040069463
- Publication date Apr 15, 2004
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered metal laminate and process for producing the same
- Publication number 20040065717
- Publication date Apr 8, 2004
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film with multilayered metal and process for producing the same
- Publication number 20040038050
- Publication date Feb 26, 2004
- Kinji Saijo
- B32 - LAYERED PRODUCTS
Information Patent Application
Clad plate for forming interposer for semiconductor device, interpo...
- Publication number 20030186484
- Publication date Oct 2, 2003
- TOYO KOHAN LTD.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20030133277
- Publication date Jul 17, 2003
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, metal laminated plate for fabricating circuit...
- Publication number 20030134497
- Publication date Jul 17, 2003
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clad sheet for printed circuit board, a multilayered printed circui...
- Publication number 20020166840
- Publication date Nov 14, 2002
- TOYO KOHAN CO., LTD
- Kinji Saijo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Shinji Ohsawa

Person

Patents Grantslast 30 patents

Hydrogen separation membrane with a carrier, fuel cell and hydrogen...

Printed wiring board and method for manufacturing printed wiring board

Multilayer printed wiring board and method of manufacturing the same

Multilayered metal laminate and process for producing the same

Gas separating unit and method for manufacturing the same

Clad plate for forming interposer for semiconductor device, interpo...

Semiconductor device, metal laminated plate for fabricating circuit...

Clad plate for forming interposer for semiconductor device, interpo...

Clad board for printed-circuit board, multilayered printed-circuit...

Method of manufacturing metal foil/ceramics joining material and me...

Clad sheet for printed circuit board, a multilayered printed circui...

Patents Applicationslast 30 patents

Hydrogen Separation Membrane with a Carrier, Fuel Cell and Hydrogen...

Printed wiring board and method for manufacturing printed wiring board

Multilayered metal laminate and process for producing the same

Multilayer printed wiring board and method of manufacturing the same

Electronic circuit device and porduction method therefor

Gas separating unit and method for manufacturing the same

High polymer plate and conductive plate connecting body, and part u...

Hollow laminate and heat sink using the same

Multilayered metal laminate and process for producing the same

Film with multilayered metal and process for producing the same

Clad plate for forming interposer for semiconductor device, interpo...

Multilayer printed wiring board and method of manufacturing the same

Semiconductor device, metal laminated plate for fabricating circuit...

Clad sheet for printed circuit board, a multilayered printed circui...