Shinji ROKUHARA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical communication device, reception apparatus, transmission app...
- Patent number 10,634,862
- Issue date Apr 28, 2020
- Sony Corporation
- Shinji Rokuhara
- G02 - OPTICS
Information Patent Grant
Wiring board, and manufacturing method
- Patent number 10,593,606
- Issue date Mar 17, 2020
- Sony Corporation
- Kousuke Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, compone...
- Patent number 10,410,884
- Issue date Sep 10, 2019
- Sony Corporation
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical communication device, reception apparatus, transmission app...
- Patent number 10,168,498
- Issue date Jan 1, 2019
- Sony Corporation
- Shinji Rokuhara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring substrate and manufacturing method of wiring substrate
- Patent number 10,109,571
- Issue date Oct 23, 2018
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, compone...
- Patent number 9,723,724
- Issue date Aug 1, 2017
- Sony Corporation
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and electronic apparatus
- Patent number 9,648,794
- Issue date May 9, 2017
- Sony Corporation
- Shinji Rokuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical communication device, reception apparatus, transmission app...
- Patent number 9,614,347
- Issue date Apr 4, 2017
- Sony Corporation
- Shinji Rokuhara
- G02 - OPTICS
Information Patent Grant
Thin-film capacitor, multilayer wiring board and semiconductor device
- Patent number 8,497,567
- Issue date Jul 30, 2013
- Sony Corporation
- Shinji Rokuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circular shield of a circuit-substrate laminated module and electro...
- Patent number 8,482,107
- Issue date Jul 9, 2013
- Sony Corporation
- Shinji Rokuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board laminated module and electronic equipment
- Patent number 8,254,144
- Issue date Aug 28, 2012
- Sony Corporation
- Katsuji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APP...
- Publication number 20190094477
- Publication date Mar 28, 2019
- SONY CORPORATION
- Shinji Rokuhara
- G02 - OPTICS
Information Patent Application
WIRING BOARD, AND MANUFACTURING METHOD
- Publication number 20180145004
- Publication date May 24, 2018
- SONY CORPORATION
- Kousuke SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, COMPONE...
- Publication number 20170301558
- Publication date Oct 19, 2017
- SONY CORPORATION
- Shun Mitarai
- G02 - OPTICS
Information Patent Application
OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APP...
- Publication number 20170205596
- Publication date Jul 20, 2017
- SONY CORPORATION
- Shinji Rokuhara
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC MODULE AND OPTICAL DEVICE
- Publication number 20170170339
- Publication date Jun 15, 2017
- Hiizu OOTORII
- G02 - OPTICS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20170103944
- Publication date Apr 13, 2017
- Fujitsu Limited
- Kei FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APP...
- Publication number 20150145086
- Publication date May 28, 2015
- SONY CORPORATION
- Shinji Rokuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, COMPONE...
- Publication number 20150021081
- Publication date Jan 22, 2015
- SONY CORPORATION
- Shun Mitarai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC APPARATUS
- Publication number 20130265736
- Publication date Oct 10, 2013
- SONY CORPORATION
- Shinji ROKUHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20130149464
- Publication date Jun 13, 2013
- SONY CORPORATION
- Shinji Rokuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR, MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20120326272
- Publication date Dec 27, 2012
- SONY CORPORATION
- Shinji ROKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit-substrate laminated module and electronic apparatus
- Publication number 20110156224
- Publication date Jun 30, 2011
- SONY CORPORATION
- Shinji Rokuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board laminated module and electronic equipment
- Publication number 20110157857
- Publication date Jun 30, 2011
- SONY CORPORATION
- Katsuji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shinji ROKUHARA

Person

Patents Grantslast 30 patents

Optical communication device, reception apparatus, transmission app...

Wiring board, and manufacturing method

Wiring substrate, method of manufacturing wiring substrate, compone...

Optical communication device, reception apparatus, transmission app...

Wiring substrate and manufacturing method of wiring substrate

Wiring substrate, method of manufacturing wiring substrate, compone...

Wiring board and electronic apparatus

Optical communication device, reception apparatus, transmission app...

Thin-film capacitor, multilayer wiring board and semiconductor device

Circular shield of a circuit-substrate laminated module and electro...

Circuit board laminated module and electronic equipment

Patents Applicationslast 30 patents

OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APP...

WIRING BOARD, AND MANUFACTURING METHOD

WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, COMPONE...

OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APP...

PHOTOELECTRIC MODULE AND OPTICAL DEVICE

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APP...

WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, COMPONE...

WIRING BOARD AND ELECTRONIC APPARATUS

METHOD OF MANUFACTURING CIRCUIT BOARD

THIN-FILM CAPACITOR, MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE

Circuit-substrate laminated module and electronic apparatus

Circuit board laminated module and electronic equipment