Shinji Takase

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of optical electronic components and optical e...
- Patent number 8,771,563
- Issue date Jul 8, 2014
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method of optical electronic components and optical e...
- Patent number 8,696,951
- Issue date Apr 15, 2014
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical electronic component
- Patent number 8,193,558
- Issue date Jun 5, 2012
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin-sealing and molding an optical device
- Patent number 7,985,357
- Issue date Jul 26, 2011
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing optical electronic component
- Patent number 7,811,491
- Issue date Oct 12, 2010
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing method for electronic part and mold used for the method
- Patent number 7,618,573
- Issue date Nov 17, 2009
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Patent number 7,056,770
- Issue date Jun 6, 2006
- Towa Corporation
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulation molding method of electronic part and resin enc...
- Patent number 6,977,188
- Issue date Dec 20, 2005
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of introducing resin for electronic component and apparatus...
- Patent number 6,929,977
- Issue date Aug 16, 2005
- Towa Corporation
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, method of sealing electronic component with r...
- Patent number 6,438,826
- Issue date Aug 27, 2002
- Towa Corporation
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN-MOLDING DEVICE AND METHOD FOR PRODUCING RESIN-MOLDED PRODUCT
- Publication number 20190001536
- Publication date Jan 3, 2019
- TOWA CORPORATION
- Yoshito OKUNISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF FORMING LIGHT EMITTER AND MOLDING DIE
- Publication number 20100006215
- Publication date Jan 14, 2010
- TOWA CORPORATION
- Kazuki Kawakubo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART
- Publication number 20090291532
- Publication date Nov 26, 2009
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
OPTICAL ELECTRONIC COMPONENT
- Publication number 20090258189
- Publication date Oct 15, 2009
- Shinji TAKASE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESS...
- Publication number 20090189310
- Publication date Jul 30, 2009
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing method of optical electronic components and optical e...
- Publication number 20070138696
- Publication date Jun 21, 2007
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing method of optical electronic components and optical e...
- Publication number 20070132135
- Publication date Jun 14, 2007
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin-sealing and molding apparatus of optical device
- Publication number 20070110839
- Publication date May 17, 2007
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin-sealing and molding an optical device
- Publication number 20070013090
- Publication date Jan 18, 2007
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin sealing method for electronic part and mold used for the method
- Publication number 20060186576
- Publication date Aug 24, 2006
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin-sealing and molding an optical device
- Publication number 20050242452
- Publication date Nov 3, 2005
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Publication number 20040101631
- Publication date May 27, 2004
- TOWA CORPORATION
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of introducing resin for electronic component and apparatus...
- Publication number 20040063234
- Publication date Apr 1, 2004
- TOWA CORPORATION
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin encapsulation molding method of electronic part and resin enc...
- Publication number 20040048416
- Publication date Mar 11, 2004
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electronic component, method of sealing electronic component with r...
- Publication number 20010013424
- Publication date Aug 16, 2001
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS

Shinji Takase

Person

Patents Grantslast 30 patents

Manufacturing method of optical electronic components and optical e...

Manufacturing method of optical electronic components and optical e...

Optical electronic component

Method of resin-sealing and molding an optical device

Method for manufacturing optical electronic component

Resin sealing method for electronic part and mold used for the method

Method of resin encapsulation, apparatus for resin encapsulation, m...

Resin encapsulation molding method of electronic part and resin enc...

Method of introducing resin for electronic component and apparatus...

Electronic component, method of sealing electronic component with r...

Patents Applicationslast 30 patents

RESIN-MOLDING DEVICE AND METHOD FOR PRODUCING RESIN-MOLDED PRODUCT

METHOD OF FORMING LIGHT EMITTER AND MOLDING DIE

METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART

OPTICAL ELECTRONIC COMPONENT

SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESS...

Manufacturing method of optical electronic components and optical e...

Manufacturing method of optical electronic components and optical e...

Resin-sealing and molding apparatus of optical device

Method of resin-sealing and molding an optical device

Resin sealing method for electronic part and mold used for the method

Method of resin-sealing and molding an optical device

Method of resin encapsulation, apparatus for resin encapsulation, m...

Method of introducing resin for electronic component and apparatus...

Resin encapsulation molding method of electronic part and resin enc...

Electronic component, method of sealing electronic component with r...