Shinji Toyosaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus
- Patent number 6,112,969
- Issue date Sep 5, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 6,105,848
- Issue date Aug 22, 2000
- Mitsubishi Denki Kabushki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 5,838,071
- Issue date Nov 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS