Shinji Tsuchikawa

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition, prepreg, laminate, metal-clad lami...
- Patent number 12,168,709
- Issue date Dec 17, 2024
- Resonac Corporation
- Koji Morita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for coreless substrate, coreless substrate and semiconducto...
- Patent number 11,581,212
- Issue date Feb 14, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Hiroshi Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, laminate, printed wiring board, coreless substrate, semico...
- Patent number 11,214,660
- Issue date Jan 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless substrate prepreg, coreless substrate, coreless substrate...
- Patent number 10,681,807
- Issue date Jun 9, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and prepreg and laminate both made...
- Patent number 10,604,641
- Issue date Mar 31, 2020
- Hitachi Chemical Company, Ltd.
- Shinji Tsuchikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition, method for producing resin composi...
- Patent number 10,414,943
- Issue date Sep 17, 2019
- Hitachi Chemical Company, Ltd.
- Yoshihiro Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, and prepreg, insulating film with...
- Patent number 10,119,047
- Issue date Nov 6, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition and prepreg and laminate obtained w...
- Patent number 9,603,244
- Issue date Mar 21, 2017
- Hitachi Chemical Company, Ltd.
- Shinji Tsuchikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, laminate obtained with the same and printed-wiring board
- Patent number 9,079,376
- Issue date Jul 14, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing curing agent having acidic substituent and uns...
- Patent number 8,796,473
- Issue date Aug 5, 2014
- Hitachi Chemical Company, Ltd.
- Shinji Tsuchikawa
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for producing curing agent having acidic substituent and uns...
- Patent number 8,461,332
- Issue date Jun 11, 2013
- Hitachi Chemical Company, Ltd.
- Shinji Tsuchikawa
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Thermosetting resin composition, and prepreg and laminated board us...
- Patent number 7,208,539
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 7,078,106
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 6,667,107
- Issue date Dec 23, 2003
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for preparing printed circuit board
- Patent number 5,476,690
- Issue date Dec 19, 1995
- Hitachi Chemical Co., Ltd.
- Fumihiko Ohta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMI...
- Publication number 20240092958
- Publication date Mar 21, 2024
- Koji MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATE, PRINTED WIRING BOARD, CORELESS SUBSTRATE, SEMICO...
- Publication number 20200239653
- Publication date Jul 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuma YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...
- Publication number 20200107437
- Publication date Apr 2, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko SAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...
- Publication number 20200056006
- Publication date Feb 20, 2020
- Hitachi Chemical Company, Ltd.
- Hiroshi YOKOTA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...
- Publication number 20180094162
- Publication date Apr 5, 2018
- Hitachi Chemical Company, Ltd.
- Yoshihiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED W...
- Publication number 20170156207
- Publication date Jun 1, 2017
- Hitachi Chemical Company, Ltd.
- Shinji Tsuchikawa
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE...
- Publication number 20170022353
- Publication date Jan 26, 2017
- Hitachi Chemical Company, Ltd.
- Shinji TSUCHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...
- Publication number 20160234942
- Publication date Aug 11, 2016
- Hitachi Chemical Company, Ltd.
- Yoshihiro Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...
- Publication number 20160230037
- Publication date Aug 11, 2016
- Hitachi Chemical Company, Ltd.
- Yoshihiro Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermosetting Resin Composition, and Prepreg, Insulating Film With...
- Publication number 20150203715
- Publication date Jul 23, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiko KOTAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR PRODUCING COMPATIBILIZED RESIN, THERMOSETTING RESIN COM...
- Publication number 20130172459
- Publication date Jul 4, 2013
- Shinji Tsuchikawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Producing Curing Agent Having Acidic Substituent and Uns...
- Publication number 20120316263
- Publication date Dec 13, 2012
- Shinji Tsuchikawa
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...
- Publication number 20120276392
- Publication date Nov 1, 2012
- Hitachi Chemical Company, Ltd.
- Yoshihiro Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD
- Publication number 20120237751
- Publication date Sep 20, 2012
- Tomohiko KOTAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PROD...
- Publication number 20120077401
- Publication date Mar 29, 2012
- Tomohiko Kotake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE...
- Publication number 20100279129
- Publication date Nov 4, 2010
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNS...
- Publication number 20100173163
- Publication date Jul 8, 2010
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED W...
- Publication number 20100143728
- Publication date Jun 10, 2010
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and prepreg and laminated sheet usi...
- Publication number 20050234173
- Publication date Oct 20, 2005
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and use thereof
- Publication number 20040091726
- Publication date May 13, 2004
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and use thereof
- Publication number 20020147277
- Publication date Oct 10, 2002
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Shinji Tsuchikawa

Person

Patents Grantslast 30 patents

Thermosetting resin composition, prepreg, laminate, metal-clad lami...

Prepreg for coreless substrate, coreless substrate and semiconducto...

Prepreg, laminate, printed wiring board, coreless substrate, semico...

Coreless substrate prepreg, coreless substrate, coreless substrate...

Thermosetting resin composition and prepreg and laminate both made...

Thermosetting resin composition, method for producing resin composi...

Thermosetting resin composition, and prepreg, insulating film with...

Thermosetting resin composition and prepreg and laminate obtained w...

Prepreg, laminate obtained with the same and printed-wiring board

Method for producing curing agent having acidic substituent and uns...

Method for producing curing agent having acidic substituent and uns...

Thermosetting resin composition, and prepreg and laminated board us...

Thermosetting resin composition and use thereof

Thermosetting resin composition and use thereof

Process for preparing printed circuit board

Patents Applicationslast 30 patents

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMI...

PREPREG, LAMINATE, PRINTED WIRING BOARD, CORELESS SUBSTRATE, SEMICO...

CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...

PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...

THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED W...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE...

THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...

THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...

Thermosetting Resin Composition, and Prepreg, Insulating Film With...

PROCESS FOR PRODUCING COMPATIBILIZED RESIN, THERMOSETTING RESIN COM...

Method for Producing Curing Agent Having Acidic Substituent and Uns...

THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSI...

PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD

RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PROD...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE...

METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNS...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED W...

Thermosetting resin composition and prepreg and laminated sheet usi...

Thermosetting resin composition and use thereof

Thermosetting resin composition and use thereof