Shinji UEYAMA

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Inspection device
- Patent number 12,327,579
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Shinji Ueyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for manufacturing semiconductor device and method of manu...
- Patent number 12,051,604
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic property measurement apparatus
- Patent number 11,796,608
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Harutaka Sekiya
- G01 - MEASURING TESTING
Information Patent Grant
Wafer bonding method, method for manufacturing semiconductor device...
- Patent number 10,847,369
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Shinji Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of testing an object and apparatus for performing the same
- Patent number 10,444,162
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Shinji Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Fluid pressure actuator
- Patent number 9,726,204
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Masato Kajinami
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Recognition apparatus, recognition method, mounting apparatus, and...
- Patent number 9,319,593
- Issue date Apr 19, 2016
- Samsung Electronics Co., Ltd.
- Ueyama Shinji
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method of recognizing an object, and apparatus and me...
- Patent number 9,218,654
- Issue date Dec 22, 2015
- Samsung Electronics Co., Ltd.
- Ueyama Shinji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus and mounting method for flip chip bonding semico...
- Patent number 9,209,051
- Issue date Dec 8, 2015
- Samsung Electronics Co., Ltd.
- Yukimori Yoshiaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bonding apparatus and method of forming semicond...
- Patent number 9,082,885
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki Yukimori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20240272245
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- KEN OZAWA
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION DEVICE
- Publication number 20240201104
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- KENJI SUZUKI
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD
- Publication number 20240183657
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Daisuke NAGATOMO
- G01 - MEASURING TESTING
Information Patent Application
EXPOSURE APPARATUS AND DECONTAMINATION APPARATUS
- Publication number 20240094646
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Katsunobu NISHIHARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLARIZED MICROSCOPE AND INTRA IMAGE FIELD CORRECTION ANALYSIS METHOD
- Publication number 20230305282
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Ken OZAWA
- G02 - OPTICS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230187249
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Daisuke NAGATOMO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION DEVICE
- Publication number 20230125628
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Shinji UEYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...
- Publication number 20220216077
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
MAGNETIC PROPERTY MEASUREMENT APPARATUS
- Publication number 20220137160
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Harutaka SEKIYA
- G01 - MEASURING TESTING
Information Patent Application
WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20200209164
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Shinji UEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME
- Publication number 20180284032
- Publication date Oct 4, 2018
- Samsung Electronics Co., Ltd.
- SHINJI UEYAMA
- G01 - MEASURING TESTING
Information Patent Application
FLUID PRESSURE ACTUATOR
- Publication number 20150159681
- Publication date Jun 11, 2015
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...
- Publication number 20150024551
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki YUKIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOGNITION APPARATUS, RECOGNITION METHOD, MOUNTING APPARATUS, AND...
- Publication number 20140160272
- Publication date Jun 12, 2014
- Samsung Electronics Co., Ltd.
- Ueyama SHINJI
- G01 - MEASURING TESTING
Information Patent Application
AUTO FOCUS CONTROL APPARATUS, SEMICONDUCTOR INSPECTING APPARATUS AN...
- Publication number 20140152796
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Togashi Mitsuhiro
- G02 - OPTICS
Information Patent Application
MOUNTING APPARATUS AND MOUNTING METHOD
- Publication number 20140154838
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Yukimori YOSHIAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFOCAL OPTICAL INSPECTION APPARATUS AND CONFOCAL OPTICAL INSPECTI...
- Publication number 20140152797
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Togashi MITSUHIRO
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND ME...
- Publication number 20140141539
- Publication date May 22, 2014
- Samsung Electronics Co., Ltd.
- Ueyama SHINJI
- G01 - MEASURING TESTING

Shinji UEYAMA

Person

Patents Grantslast 30 patents

Inspection device

Apparatus for manufacturing semiconductor device and method of manu...

Magnetic property measurement apparatus

Wafer bonding method, method for manufacturing semiconductor device...

Method of testing an object and apparatus for performing the same

Fluid pressure actuator

Recognition apparatus, recognition method, mounting apparatus, and...

Apparatus and method of recognizing an object, and apparatus and me...

Mounting apparatus and mounting method for flip chip bonding semico...

Semiconductor chip bonding apparatus and method of forming semicond...

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING...

INSPECTION DEVICE

OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD

EXPOSURE APPARATUS AND DECONTAMINATION APPARATUS

POLARIZED MICROSCOPE AND INTRA IMAGE FIELD CORRECTION ANALYSIS METHOD

MOUNTING DEVICE AND MOUNTING METHOD

INSPECTION DEVICE

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...

MAGNETIC PROPERTY MEASUREMENT APPARATUS

WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME

FLUID PRESSURE ACTUATOR

SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...

RECOGNITION APPARATUS, RECOGNITION METHOD, MOUNTING APPARATUS, AND...

AUTO FOCUS CONTROL APPARATUS, SEMICONDUCTOR INSPECTING APPARATUS AN...

MOUNTING APPARATUS AND MOUNTING METHOD

CONFOCAL OPTICAL INSPECTION APPARATUS AND CONFOCAL OPTICAL INSPECTI...

APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND ME...