Shinji Wakisaka

Person

Hanno, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,328,998
- Issue date May 10, 2022
- AOI Electronics Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 9,406,637
- Issue date Aug 2, 2016
- Aoi Electronics Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor construct installed on...
- Patent number 9,343,428
- Issue date May 17, 2016
- TERA PROBE, INC.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor construct installed on...
- Patent number 9,105,580
- Issue date Aug 11, 2015
- TERA PROBE, INC.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 8,946,079
- Issue date Feb 3, 2015
- Tera Probe, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 8,754,525
- Issue date Jun 17, 2014
- Tera Probe, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 8,525,335
- Issue date Sep 3, 2013
- Teramikros, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, manufacturing method of semiconductor stru...
- Patent number 8,487,443
- Issue date Jul 16, 2013
- Teramikros, Inc.
- Shinji Wakisaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 8,319,346
- Issue date Nov 27, 2012
- Teramikros, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor element surrounded by...
- Patent number RE43380
- Issue date May 15, 2012
- Teramikros, Inc.
- Shinji Wakisaka
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device having alignment post electrode and method of...
- Patent number 7,944,064
- Issue date May 17, 2011
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having semiconductor f...
- Patent number 7,888,238
- Issue date Feb 15, 2011
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Network electronic component, semiconductor device incorporating ne...
- Patent number 7,808,073
- Issue date Oct 5, 2010
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device including semiconductor element surrounded by...
- Patent number 7,692,282
- Issue date Apr 6, 2010
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor element surrounded by...
- Patent number 7,563,640
- Issue date Jul 21, 2009
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having semiconductor constructing body and me...
- Patent number 7,553,698
- Issue date Jun 30, 2009
- Casio Computer Co., Ltd.
- Takeshi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased number of external connection e...
- Patent number 7,427,812
- Issue date Sep 23, 2008
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor element surrounded by...
- Patent number 7,368,813
- Issue date May 6, 2008
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having semiconductor constructing body and me...
- Patent number 7,075,181
- Issue date Jul 11, 2006
- Casio Computer Co., Ltd.
- Takeshi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation layer
- Patent number 7,042,081
- Issue date May 9, 2006
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Manufacturing Method of Semiconductor Device
- Publication number 20210082820
- Publication date Mar 18, 2021
- AOI ELECTRONICS CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20150311181
- Publication date Oct 29, 2015
- TERA PROBE, INC.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20150097302
- Publication date Apr 9, 2015
- TERA PROBE, INC.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20140287555
- Publication date Sep 25, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20130320526
- Publication date Dec 5, 2013
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110304043
- Publication date Dec 15, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...
- Publication number 20110233787
- Publication date Sep 29, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD OF SEMICONDUCTOR STRU...
- Publication number 20110233739
- Publication date Sep 29, 2011
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE FORMATION SUBSTRATE AND SEMICONDUCTOR DEVICE M...
- Publication number 20110133185
- Publication date Jun 9, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20110115080
- Publication date May 19, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20110001238
- Publication date Jan 6, 2011
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100233853
- Publication date Sep 16, 2010
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LA...
- Publication number 20100059895
- Publication date Mar 11, 2010
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR F...
- Publication number 20090155982
- Publication date Jun 18, 2009
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY...
- Publication number 20080044944
- Publication date Feb 21, 2008
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY...
- Publication number 20080006943
- Publication date Jan 10, 2008
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having alignment post electrode and method of...
- Publication number 20070164432
- Publication date Jul 19, 2007
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having semiconductor constructing body and me...
- Publication number 20060141669
- Publication date Jun 29, 2006
- CASIO COMPUTER CO., LTD.
- Takeshi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Network electronic component, semiconductor device incorporating ne...
- Publication number 20050218473
- Publication date Oct 6, 2005
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor device with increased number of external connection e...
- Publication number 20050200018
- Publication date Sep 15, 2005
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050140021
- Publication date Jun 30, 2005
- CASIO COMPUTER., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having heat dissipation layer
- Publication number 20050062147
- Publication date Mar 24, 2005
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having semiconductor constructing body and me...
- Publication number 20050019982
- Publication date Jan 27, 2005
- CASIO COMPUTER CO., LTD.
- Takeshi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having alignment post electrode and method of...
- Publication number 20040238973
- Publication date Dec 2, 2004
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS

Shinji Wakisaka

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method of semiconductor device

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor device including semiconductor construct installed on...

Semiconductor device including semiconductor construct installed on...

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor structure, manufacturing method of semiconductor stru...

Semiconductor structure and manufacturing method of semiconductor s...

Semiconductor device including semiconductor element surrounded by...

Semiconductor device having alignment post electrode and method of...

Method of manufacturing semiconductor device having semiconductor f...

Network electronic component, semiconductor device incorporating ne...

Semiconductor device including semiconductor element surrounded by...

Semiconductor device including semiconductor element surrounded by...

Semiconductor package having semiconductor constructing body and me...

Semiconductor device with increased number of external connection e...

Semiconductor device including semiconductor element surrounded by...

Semiconductor package having semiconductor constructing body and me...

Semiconductor device having heat dissipation layer

Patents Applicationslast 30 patents

Semiconductor Device and Manufacturing Method of Semiconductor Device

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...

SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD OF SEMICONDUCTOR STRU...

SEMICONDUCTOR DEVICE FORMATION SUBSTRATE AND SEMICONDUCTOR DEVICE M...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR F...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY...

Semiconductor device having alignment post electrode and method of...

Semiconductor package having semiconductor constructing body and me...

Network electronic component, semiconductor device incorporating ne...

Semiconductor device with increased number of external connection e...

Semiconductor device and manufacturing method thereof

Semiconductor device having heat dissipation layer

Semiconductor package having semiconductor constructing body and me...

Semiconductor device having alignment post electrode and method of...