Shinji WATANABE

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,312,199
- Issue date Jun 4, 2019
- Renesas Electronics Corporation
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,141,273
- Issue date Nov 27, 2018
- Renesas Electronics Corporation
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,837,382
- Issue date Dec 5, 2017
- J-DEVICE CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding package of non-volatile magnetic memory element
- Patent number 9,553,052
- Issue date Jan 24, 2017
- J-Devices Corporation
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 9,368,474
- Issue date Jun 14, 2016
- J-DEVICES CORPORATION
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,304,905
- Issue date Nov 6, 2012
- Renesas Electronics Corporation
- Satoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226362
- Publication date Aug 9, 2018
- RENESAS ELECTRONICS CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170047296
- Publication date Feb 16, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160300779
- Publication date Oct 13, 2016
- J-DEVICE CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT
- Publication number 20160172580
- Publication date Jun 16, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20160079204
- Publication date Mar 17, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160027715
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150371934
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Hirokazu HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150179623
- Publication date Jun 25, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150179615
- Publication date Jun 25, 2015
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120025371
- Publication date Feb 2, 2012
- RENESAS ELECTRONICS CORPORATION
- Satoshi MATSUI
- H01 - BASIC ELECTRIC ELEMENTS

Shinji WATANABE

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package

Magnetic shielding package of non-volatile magnetic memory element

Manufacturing method for semiconductor device

Heat sink in the aperture of substrate

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE