Shinjiro HAYASHI

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Catalyst solution for electroless plating
- Patent number 10,543,482
- Issue date Jan 28, 2020
- Rohm and Haas Electronic Materials LLC
- Hiroki Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating solution and method of copper electroplating
- Patent number 9,637,833
- Issue date May 2, 2017
- Rohm and Haas Electronic Materials LLC
- Matsuko Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating solution and method of copper electroplating
- Patent number 9,175,413
- Issue date Nov 3, 2015
- Rohm and Haas Electronic Materials LLC
- Mutsuko Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper plating solution and method of electrolytic cop...
- Patent number 9,169,576
- Issue date Oct 27, 2015
- Rohm and Haas Electronic Materials LLC
- Mutsuko Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating liquid and the electrolytic copper plat...
- Patent number 9,150,976
- Issue date Oct 6, 2015
- Rohm and Haas Electronic Materials LLC
- Mutsuko Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating bath formulation
- Patent number 7,857,961
- Issue date Dec 28, 2010
- Rohm and Haas Electronic Materials LLC
- Shinjiro Hayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating process
- Patent number 7,857,960
- Issue date Dec 28, 2010
- Rohm and Haas Electronic Materials LLC
- Shinjiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method
- Patent number 7,374,652
- Issue date May 20, 2008
- Rohm and Haas Electronic Materials LLC
- Shinjiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrolytic copper plating
- Patent number 6,977,035
- Issue date Dec 20, 2005
- Shipley Company, L.L.C.
- Hideki Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper plating solution and method for controlling the...
- Patent number 6,881,319
- Issue date Apr 19, 2005
- Shipley Company, L.L.C.
- Masaru Seita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper plating method
- Patent number 6,835,294
- Issue date Dec 28, 2004
- Shipley Company, L.L.C.
- Hideki Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION
- Publication number 20160186348
- Publication date Jun 30, 2016
- Rohm and Haas Electronic Materials L.L.C.
- Yoko Mizuno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CATALYST SOLUTION FOR ELECTROLESS PLATING
- Publication number 20150118406
- Publication date Apr 30, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Hiroki OKADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING
- Publication number 20140183052
- Publication date Jul 3, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Mutsuko SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING
- Publication number 20140174937
- Publication date Jun 26, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Matsuko Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING LIQUID AND THE ELECTROLYTIC COPPER PLAT...
- Publication number 20140097087
- Publication date Apr 10, 2014
- Mutsuko SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD OF ELECTROLYTIC COP...
- Publication number 20130319867
- Publication date Dec 5, 2013
- Mutsuko SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN PLATING SOLUTION
- Publication number 20120132530
- Publication date May 31, 2012
- Rohm and Haas Electronic Materials L.L.C.
- Shinjiro HAYASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plating process
- Publication number 20090038949
- Publication date Feb 12, 2009
- Rohm and Haas Electronic Materials L.L.C.
- Shinjiro Hayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plating bath formulation
- Publication number 20090038951
- Publication date Feb 12, 2009
- Rohm and Haas Electronic Materials L.L.C.
- Shinjiro Hayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method
- Publication number 20070007143
- Publication date Jan 11, 2007
- Rohm and Haas Electronic Materials L.L.C.
- Shinjiro Hayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electrolytic copper plating
- Publication number 20040217008
- Publication date Nov 4, 2004
- Shipley Company, L.L.C.
- Hideki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for electrolytic copper plating
- Publication number 20040089557
- Publication date May 13, 2004
- Shipley Company, L.L.C.
- Hideki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic copper plating solution and method for controlling the...
- Publication number 20030094376
- Publication date May 22, 2003
- Shipley Company, L.L.C.
- Masaru Seita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic copper plating method
- Publication number 20030015433
- Publication date Jan 23, 2003
- Shipley Company, L.L.C.
- Hideki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Shinjiro HAYASHI

Person

Patents Grantslast 30 patents

Catalyst solution for electroless plating

Copper electroplating solution and method of copper electroplating

Copper electroplating solution and method of copper electroplating

Electrolytic copper plating solution and method of electrolytic cop...

Electrolytic copper plating liquid and the electrolytic copper plat...

Copper plating bath formulation

Copper plating process

Plating method

Method for electrolytic copper plating

Electrolytic copper plating solution and method for controlling the...

Electrolytic copper plating method

Patents Applicationslast 30 patents

ELECTROLYTIC COPPER PLATING SOLUTION

CATALYST SOLUTION FOR ELECTROLESS PLATING

COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING

COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING

ELECTROLYTIC COPPER PLATING LIQUID AND THE ELECTROLYTIC COPPER PLAT...

ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD OF ELECTROLYTIC COP...

TIN PLATING SOLUTION

Copper plating process

Copper plating bath formulation

Plating method

Method for electrolytic copper plating

Process for electrolytic copper plating

Electrolytic copper plating solution and method for controlling the...

Electrolytic copper plating method