Shinjiro Tsuji

Person

Kadoma-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component bonding device
- Patent number 10,479,061
- Issue date Nov 19, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Kameda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Component crimping apparatus
- Patent number 10,065,275
- Issue date Sep 4, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting line and component mounting method
- Patent number 9,983,421
- Issue date May 29, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Satoshi Adachi
- G02 - OPTICS
Information Patent Grant
Component crimping apparatus
- Patent number 9,872,395
- Issue date Jan 16, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component crimping apparatus
- Patent number 9,739,300
- Issue date Aug 22, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Yamada
- G02 - OPTICS
Information Patent Grant
Tape splicing apparatus and attaching apparatus
- Patent number 8,062,450
- Issue date Nov 22, 2011
- Panasonic Corporation
- Kozo Odawara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate edge part cleaning apparatus and substrate edge part clea...
- Patent number 7,803,231
- Issue date Sep 28, 2010
- Panasonic Corporation
- Ryouichirou Katano
- B08 - CLEANING
Information Patent Grant
Apparatus and method for cleaning a board terminal
- Patent number 7,799,142
- Issue date Sep 21, 2010
- Panasonic Corporation
- Masaya Watanabe
- B08 - CLEANING
Information Patent Grant
Method for transferring a substrate
- Patent number 7,716,818
- Issue date May 18, 2010
- Panasonic Corporation
- Shinjiro Tsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and mounter
- Patent number 7,653,989
- Issue date Feb 2, 2010
- Panasonic Corporation
- Takahiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet stamping device, adhesive sheet stamping method
- Patent number 7,285,175
- Issue date Oct 23, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tomotaka Nishimoto
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic component, component mounting equipment, and component m...
- Patent number 7,220,922
- Issue date May 22, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kenichi Nishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus and component mounting method, and rec...
- Patent number 7,089,073
- Issue date Aug 8, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinjiro Tsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus and component mounting method
- Patent number 7,021,357
- Issue date Apr 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Ryoichiro Katano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying tape to object by applying pressure thereto
- Patent number 5,766,402
- Issue date Jun 16, 1998
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiko Muraoka
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Tape carrier package mounting apparatus with heaters for bonding tools
- Patent number 5,575,059
- Issue date Nov 19, 1996
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiko Muraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT MOUNTING LINE AND COMPONENT MOUNTING METHOD
- Publication number 20160286664
- Publication date Sep 29, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Satoshi ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CRIMPING APPARATUS
- Publication number 20160113164
- Publication date Apr 21, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Akira KAMEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CRIMPING APPARATUS
- Publication number 20160052196
- Publication date Feb 25, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Akira YAMADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPONENT CRIMPING APPARATUS
- Publication number 20160052197
- Publication date Feb 25, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Akira YAMADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPONENT BONDING DEVICE
- Publication number 20150367618
- Publication date Dec 24, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Akira KAMEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
TAPE SPLICING APPARATUS AND ATTACHING APPARATUS
- Publication number 20090288777
- Publication date Nov 26, 2009
- Matsushita Electric Industrial Co., Ltd.
- Kozo Odawara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for Cleaning a Board Terminal
- Publication number 20090065029
- Publication date Mar 12, 2009
- Masaya Watanabe
- B08 - CLEANING
Information Patent Application
Substrate Processing Apparatus and Mounter
- Publication number 20080301932
- Publication date Dec 11, 2008
- Takahiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Transfer Apparatus, Component Mounting Equipment, and Sub...
- Publication number 20080193262
- Publication date Aug 14, 2008
- Shinjiro Tsuji
- G02 - OPTICS
Information Patent Application
Substrate edge part cleaning apparatus and substrate edge part clea...
- Publication number 20070181152
- Publication date Aug 9, 2007
- Ryouichirou Katano
- B08 - CLEANING
Information Patent Application
Adhesive sheet stamping device, adhesive sheet stamping method, par...
- Publication number 20050260341
- Publication date Nov 24, 2005
- Tomotaka Nishimoto
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Electronic component component mounting equipment and component mou...
- Publication number 20040060666
- Publication date Apr 1, 2004
- Kenichi Nishino
- G02 - OPTICS
Information Patent Application
Component mounting apparatus and component mounting method
- Publication number 20030070280
- Publication date Apr 17, 2003
- Ryoichiro Katano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component mounting apparatus and component mounting method, and rec...
- Publication number 20030033034
- Publication date Feb 13, 2003
- Shinjiro Tsuji
- G05 - CONTROLLING REGULATING

Shinjiro Tsuji

Person

Patents Grantslast 30 patents

Component bonding device

Component crimping apparatus

Component mounting line and component mounting method

Component crimping apparatus

Component crimping apparatus

Tape splicing apparatus and attaching apparatus

Substrate edge part cleaning apparatus and substrate edge part clea...

Apparatus and method for cleaning a board terminal

Method for transferring a substrate

Substrate processing apparatus and mounter

Adhesive sheet stamping device, adhesive sheet stamping method

Electronic component, component mounting equipment, and component m...

Component mounting apparatus and component mounting method, and rec...

Component mounting apparatus and component mounting method

Apparatus for applying tape to object by applying pressure thereto

Tape carrier package mounting apparatus with heaters for bonding tools

Patents Applicationslast 30 patents

COMPONENT MOUNTING LINE AND COMPONENT MOUNTING METHOD

COMPONENT CRIMPING APPARATUS

COMPONENT CRIMPING APPARATUS

COMPONENT CRIMPING APPARATUS

COMPONENT BONDING DEVICE

TAPE SPLICING APPARATUS AND ATTACHING APPARATUS

Apparatus and Method for Cleaning a Board Terminal

Substrate Processing Apparatus and Mounter

Substrate Transfer Apparatus, Component Mounting Equipment, and Sub...

Substrate edge part cleaning apparatus and substrate edge part clea...

Adhesive sheet stamping device, adhesive sheet stamping method, par...

Electronic component component mounting equipment and component mou...

Component mounting apparatus and component mounting method

Component mounting apparatus and component mounting method, and rec...