Shinjiro Watanabe

Person

Nirasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate misalignment detection method, substrate position abnorma...
- Patent number 11,715,657
- Issue date Aug 1, 2023
- Tokyo Electron Limited
- Shinjiro Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection system
- Patent number 11,499,992
- Issue date Nov 15, 2022
- Tokyo Electron Limited
- Shinjiro Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Probe card management system and probe card management method
- Patent number 11,340,259
- Issue date May 24, 2022
- Tokyo Electron Limited
- Shinjiro Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Coating film forming apparatus
- Patent number 9,296,010
- Issue date Mar 29, 2016
- Tokyo Electron Limited
- Shinjiro Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,105,452
- Issue date Jan 31, 2012
- Tokyo Electron Limited
- Shinjiro Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 7,896,052
- Issue date Mar 1, 2011
- Tokyo Electron Limited
- Shinjiro Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum prober and vacuum probe method
- Patent number 7,221,176
- Issue date May 22, 2007
- Tokyo Electron Limited
- Haruhiko Yoshioka
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SETTING UP TEST APPARATUS AND TEST APPARATUS
- Publication number 20240118338
- Publication date Apr 11, 2024
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G01 - MEASURING TESTING
Information Patent Application
TESTING DEVICE AND METHOD, AND NON-TRANSITORY COMPUTER-READABLE REC...
- Publication number 20240019483
- Publication date Jan 18, 2024
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
- Publication number 20230314362
- Publication date Oct 5, 2023
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G01 - MEASURING TESTING
Information Patent Application
ALIGNMENT METHOD AND INSPECTION APPARATUS
- Publication number 20220381820
- Publication date Dec 1, 2022
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE MISALIGNMENT DETECTION METHOD, SUBSTRATE POSITION ABNORMA...
- Publication number 20210210366
- Publication date Jul 8, 2021
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE RECOGNITION SYSTEM AND IMAGE RECOGNITION METHOD
- Publication number 20200242747
- Publication date Jul 30, 2020
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROBE CARD MANAGEMENT SYSTEM AND PROBE CARD MANAGEMENT METHOD
- Publication number 20200191830
- Publication date Jun 18, 2020
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G01 - MEASURING TESTING
Information Patent Application
Inspection System
- Publication number 20200166542
- Publication date May 28, 2020
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROBER
- Publication number 20190187180
- Publication date Jun 20, 2019
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- G01 - MEASURING TESTING
Information Patent Application
COATING FILM FORMING APPARATUS
- Publication number 20150059644
- Publication date Mar 5, 2015
- TOKYO ELECTRON LIMITED
- Shinjiro WATANABE
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR FORMING SINTERED SILVER COATING FILM, BAKING APPARATUS,...
- Publication number 20140239484
- Publication date Aug 28, 2014
- TOKYO ELECTRON LIMITED
- Kenji MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND SEMICONDUCTOR DEVICE...
- Publication number 20130181040
- Publication date Jul 18, 2013
- TOKYO ELECTRON LIMITED
- Shinjiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20110121057
- Publication date May 26, 2011
- TOKYO ELECTRON LIMITED
- Shinjiro Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20070119535
- Publication date May 31, 2007
- TOKYO ELECTRON LIMITED
- Shinjiro Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vacuum prober and vacuum probe method
- Publication number 20050206396
- Publication date Sep 22, 2005
- Haruhiko Yoshioka
- G01 - MEASURING TESTING

Shinjiro Watanabe

Person

Patents Grantslast 30 patents

Substrate misalignment detection method, substrate position abnorma...

Inspection system

Probe card management system and probe card management method

Coating film forming apparatus

Bonding apparatus and bonding method

Bonding apparatus and bonding method

Vacuum prober and vacuum probe method

Patents Applicationslast 30 patents

METHOD FOR SETTING UP TEST APPARATUS AND TEST APPARATUS

TESTING DEVICE AND METHOD, AND NON-TRANSITORY COMPUTER-READABLE REC...

INSPECTION APPARATUS AND INSPECTION METHOD

ALIGNMENT METHOD AND INSPECTION APPARATUS

SUBSTRATE MISALIGNMENT DETECTION METHOD, SUBSTRATE POSITION ABNORMA...

IMAGE RECOGNITION SYSTEM AND IMAGE RECOGNITION METHOD

PROBE CARD MANAGEMENT SYSTEM AND PROBE CARD MANAGEMENT METHOD

Inspection System

PROBER

COATING FILM FORMING APPARATUS

METHOD FOR FORMING SINTERED SILVER COATING FILM, BAKING APPARATUS,...

SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND SEMICONDUCTOR DEVICE...

BONDING APPARATUS AND BONDING METHOD

Bonding apparatus and bonding method

Vacuum prober and vacuum probe method