Shinsuke Asada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with branch electrode terminal and method of m...
- Patent number 11,901,326
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 10,573,570
- Issue date Feb 25, 2020
- Mitsubishi Electric Corporation
- Daisuke Murata
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having press-fit terminals disposed in recesse...
- Patent number 10,388,581
- Issue date Aug 20, 2019
- Mitsubishi Electric Corporation
- Hidetoshi Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a plate-shaped lead terminal
- Patent number 9,917,064
- Issue date Mar 13, 2018
- Mitsubishi Electric Corporation
- Yusuke Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,698,091
- Issue date Jul 4, 2017
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,691,730
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,129,949
- Issue date Sep 8, 2015
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and its attachment structure
- Patent number 8,749,977
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin welded body and manufacturing method thereof
- Patent number 8,597,755
- Issue date Dec 3, 2013
- Mitsubishi Electric Corporation
- Seizo Fujimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Welding method and welding apparatus for resin member
- Patent number 8,110,062
- Issue date Feb 7, 2012
- Mitsubishi Electric Corporation
- Shinsuke Asada
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Welded resin material
- Patent number 7,862,874
- Issue date Jan 4, 2011
- Mitsubishi Electric Corporation
- Shinsuke Asada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor pressure sensor, manufacturing method thereof, and di...
- Patent number 7,603,908
- Issue date Oct 20, 2009
- Mitsubishi Electric Corporation
- Shinsuke Asada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor and die for molding a semiconductor p...
- Patent number 7,412,895
- Issue date Aug 19, 2008
- Mitsubishi Electric Corp.
- Shinsuke Asada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor
- Patent number 7,391,101
- Issue date Jun 24, 2008
- Mitsubishi Denki Kabushiki Kaisha
- Yoshimitsu Takahata
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220254749
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20190164857
- Publication date May 30, 2019
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190103330
- Publication date Apr 4, 2019
- Mitsubishi Electric Corporation
- Hidetoshi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160111379
- Publication date Apr 21, 2016
- Mitsubishi Electric Corporation
- Yusuke ISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20160104651
- Publication date Apr 14, 2016
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160099224
- Publication date Apr 7, 2016
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20130221516
- Publication date Aug 29, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND ITS ATTACHMENT STRUCTURE
- Publication number 20120236503
- Publication date Sep 20, 2012
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WELDING METHOD AND WELDING APPARATUS FOR RESIN MEMBER
- Publication number 20090126869
- Publication date May 21, 2009
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin welded body and manufacturing method thereof
- Publication number 20080261065
- Publication date Oct 23, 2008
- MITSUBISHI ELECTRIC CORPORATION
- Seizo Fujimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR PRODUCING WELDED RESIN MATERIAL AND WELDED RESIN MATERIAL
- Publication number 20080254242
- Publication date Oct 16, 2008
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor pressure sensor and die for molding the semiconductor...
- Publication number 20080178681
- Publication date Jul 31, 2008
- MITSUBISHI ELECTRIC CORP.
- Shinsuke Asada
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor pressure sensor and die for molding the one
- Publication number 20070193359
- Publication date Aug 23, 2007
- MITSUBISHI ELECTRIC CORP.
- Shinsuke Asada
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor pressure sensor
- Publication number 20070029657
- Publication date Feb 8, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Yoshimitsu Takahata
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor pressure sensor
- Publication number 20070017294
- Publication date Jan 25, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Shinsuke Asada
- G01 - MEASURING TESTING

Shinsuke Asada

Person

Patents Grantslast 30 patents

Semiconductor device with branch electrode terminal and method of m...

Semiconductor device and power conversion device

Semiconductor device having press-fit terminals disposed in recesse...

Semiconductor device with a plate-shaped lead terminal

Power semiconductor device

Semiconductor device and method for manufacturing the same

Power semiconductor module

Power semiconductor module and its attachment structure

Resin welded body and manufacturing method thereof

Welding method and welding apparatus for resin member

Welded resin material

Semiconductor pressure sensor, manufacturing method thereof, and di...

Semiconductor pressure sensor and die for molding a semiconductor p...

Semiconductor pressure sensor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE AND ITS ATTACHMENT STRUCTURE

WELDING METHOD AND WELDING APPARATUS FOR RESIN MEMBER

Resin welded body and manufacturing method thereof

METHOD FOR PRODUCING WELDED RESIN MATERIAL AND WELDED RESIN MATERIAL

Semiconductor pressure sensor and die for molding the semiconductor...

Semiconductor pressure sensor and die for molding the one

Semiconductor pressure sensor

Semiconductor pressure sensor