Shinsuke ISHIKAWA

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
COMPOUND, BONDING AGENT, BONDED BODY, PRINTED CIRCUIT BOARD, AND ME...
- Publication number 20250171470
- Publication date May 29, 2025
- DAICEL CORPORATION
- Akihiko Happoya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...
- Publication number 20250034385
- Publication date Jan 30, 2025
- DAICEL CORPORATION
- Daisuke ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...