Shinsuke Tei

Person

Musashimurayama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,232,656
- Issue date Jul 31, 2012
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 8,143,155
- Issue date Mar 27, 2012
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 7,934,634
- Issue date May 3, 2011
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, record medium storing bonding control progr...
- Patent number 7,857,190
- Issue date Dec 28, 2010
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 7,851,347
- Issue date Dec 14, 2010
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, record medium storing bonding control progr...
- Patent number 7,699,209
- Issue date Apr 20, 2010
- Kabushiki Kaisha Shinkawa
- Shinsuke Tei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, record medium storing bonding control progr...
- Patent number 7,686,204
- Issue date Mar 30, 2010
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tail wire cutting method and bonding apparatus
- Patent number 7,658,314
- Issue date Feb 9, 2010
- Kabushiki Kaisha Shinkawa
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20110079904
- Publication date Apr 7, 2011
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method and semiconductor device
- Publication number 20100207280
- Publication date Aug 19, 2010
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus, record medium storing bonding control progr...
- Publication number 20100206849
- Publication date Aug 19, 2010
- KABUSHIKI KAISHA SHINKAWA
- Kuniyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and semiconductor device
- Publication number 20100148369
- Publication date Jun 17, 2010
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus, record medium storing bonding control progr...
- Publication number 20100133322
- Publication date Jun 3, 2010
- KABUSHIKI KAISHA SHINKAWA
- Kuniyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method
- Publication number 20090194577
- Publication date Aug 6, 2009
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tail wire cutting method and bonding apparatus
- Publication number 20070246513
- Publication date Oct 25, 2007
- KABUSHIKI KAISHA SHINKAWA
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus, record medium storing bonding control progr...
- Publication number 20070187138
- Publication date Aug 16, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kuniyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus, record medium storing bonding control progr...
- Publication number 20070187470
- Publication date Aug 16, 2007
- KABUSHIKI KAISHA SHINKAWA
- Shinsuke Tei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method
- Publication number 20060175383
- Publication date Aug 10, 2006
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Shinsuke Tei

Person

Patents Grantslast 30 patents

Semiconductor device

Wire bonding method and semiconductor device

Wire bonding method

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding method and semiconductor device

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding apparatus, record medium storing bonding control progr...

Tail wire cutting method and bonding apparatus

Patents Applicationslast 30 patents

Semiconductor device

Wire bonding method and semiconductor device

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding method and semiconductor device

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding method

Tail wire cutting method and bonding apparatus

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding method