Shinsuke WADA

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electroless palladium plating solution and palladium film
- Patent number 11,492,706
- Issue date Nov 8, 2022
- C. Uyemura & Co., Ltd.
- Tetsuya Sasamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS PALLADIUM PLATING SOLUTION AND PALLADIUM FILM
- Publication number 20210054508
- Publication date Feb 25, 2021
- C. Uyemura & Co., Ltd.
- Tetsuya SASAMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM P...
- Publication number 20200248312
- Publication date Aug 6, 2020
- C. Uyemura & Co., Ltd.
- Tsuyoshi MAEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...