Shinsuke Yamaguchi

Person

Annaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-modified glass fiber film
- Patent number 10,669,197
- Issue date Jun 2, 2020
- Shin-Etsu Chemical Co., Ltd.
- Saiko Akahane
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Fiber-containing resin substrate, encapsulated semiconductor device...
- Patent number 10,600,707
- Issue date Mar 24, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electromagnetic wave shielding support base-attached encapsulant, e...
- Patent number 9,865,518
- Issue date Jan 9, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support base-attached encapsulant, encapsulated substrate having se...
- Patent number 9,312,197
- Issue date Apr 12, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- B32 - LAYERED PRODUCTS
Information Patent Grant
Epoxy resin composition, die attach method using same, and semicond...
- Patent number 8,815,400
- Issue date Aug 26, 2014
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and a method of using the same
- Patent number 7,855,245
- Issue date Dec 21, 2010
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Radiation-curable silicone rubber composition
- Patent number 6,069,186
- Issue date May 30, 2000
- Shin-Etsu Chemical Co., Ltd.
- Hiroshige Okinoshima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photo-curable organopolysiloxane composition and a method for produ...
- Patent number 5,738,976
- Issue date Apr 14, 1998
- Shin-Etsu Chemical Co., Ltd.
- Hiroshige Okinoshima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...
- Publication number 20240191029
- Publication date Jun 13, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...
- Publication number 20230140237
- Publication date May 4, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20220195096
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...
- Publication number 20210371594
- Publication date Dec 2, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FIBER-CONTAINING RESIN SUBSTRATE, ENCAPSULATED SEMICONDUCTOR DEVICE...
- Publication number 20190067147
- Publication date Feb 28, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, METHOD F...
- Publication number 20170098551
- Publication date Apr 6, 2017
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SUPPORT BASE-ATTACHED ENCAPSULANT, E...
- Publication number 20160133579
- Publication date May 12, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SE...
- Publication number 20160035638
- Publication date Feb 4, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-MODIFIED GLASS FIBER FILM
- Publication number 20150197885
- Publication date Jul 16, 2015
- Shin-Etsu Chemical Co., Ltd.
- Saiko AKAHANE
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20130197129
- Publication date Aug 1, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, DIE ATTACH METHOD USING SAME, AND SEMICOND...
- Publication number 20120193817
- Publication date Aug 2, 2012
- SHIN-ETSU CHEMICAL CO., LTD.
- Tatsuya KANAMARU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition and a method of using the same
- Publication number 20080268255
- Publication date Oct 30, 2008
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Shinsuke Yamaguchi

Person

Patents Grantslast 30 patents

Surface-modified glass fiber film

Fiber-containing resin substrate, encapsulated semiconductor device...

Electromagnetic wave shielding support base-attached encapsulant, e...

Support base-attached encapsulant, encapsulated substrate having se...

Epoxy resin composition, die attach method using same, and semicond...

Adhesive composition and a method of using the same

Radiation-curable silicone rubber composition

Photo-curable organopolysiloxane composition and a method for produ...

Patents Applicationslast 30 patents

HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...

FIBER-CONTAINING RESIN SUBSTRATE, ENCAPSULATED SEMICONDUCTOR DEVICE...

BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, METHOD F...

ELECTROMAGNETIC WAVE SHIELDING SUPPORT BASE-ATTACHED ENCAPSULANT, E...

SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SE...

SURFACE-MODIFIED GLASS FIBER FILM

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION, DIE ATTACH METHOD USING SAME, AND SEMICOND...

Adhesive composition and a method of using the same