Shintaro Aoyama

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Plano, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for reducing by-product deposition in wafer processing equip...
- Patent number 6,794,308
- Issue date Sep 21, 2004
- Texas Instruments Incorporated
- Ming Jang Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing by-product deposition in wafer processing equip...
- Patent number 6,730,613
- Issue date May 4, 2004
- Texas Instruments Incorporated
- Ming Jang Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating in-situ doped rough polycrystalline silicon u...
- Patent number 6,194,292
- Issue date Feb 27, 2001
- Texas Instruments Incorporated
- Robert Yung-Hsi Tsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REDUCING BY-PRODUCT DEPOSITION IN WAFER PROCESSING EQUIP...
- Publication number 20010000146
- Publication date Apr 5, 2001
- Ming Jang Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...