Shintaro Hashimoto

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having dolmen structure and manufacturing meth...
- Patent number 12,074,139
- Issue date Aug 27, 2024
- Tatsuya Yahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having dolmen structu...
- Patent number 11,935,870
- Issue date Mar 19, 2024
- Yoshinobu Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg for coreless substrate, coreless substrate and semiconducto...
- Patent number 11,581,212
- Issue date Feb 14, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Hiroshi Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified silicone compound, and thermosetting resin composition, pr...
- Patent number 11,401,381
- Issue date Aug 2, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiko Kotake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Prepreg, laminate, printed wiring board, coreless substrate, semico...
- Patent number 11,214,660
- Issue date Jan 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless substrate prepreg, coreless substrate, coreless substrate...
- Patent number 10,681,807
- Issue date Jun 9, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Siloxane compound, modified imide resin, thermosetting resin compos...
- Patent number 10,323,126
- Issue date Jun 18, 2019
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, and printed wiring board, laminated sheet, and p...
- Patent number 9,133,308
- Issue date Sep 15, 2015
- Hitachi Chemical Company, Ltd.
- Shunsuke Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg laminate obtained with the same and prin...
- Patent number 8,735,733
- Issue date May 27, 2014
- Hitachi Chemical Company, Ltd.
- Masato Miyatake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20240371832
- Publication date Nov 7, 2024
- Resonac Corporation
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20220157802
- Publication date May 19, 2022
- Showa Denko Materials Co., Ltd.
- Shintaro HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTU...
- Publication number 20220149009
- Publication date May 12, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinobu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20220149031
- Publication date May 12, 2022
- Showa Denko Materials Co., Ltd.
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20220149008
- Publication date May 12, 2022
- Showa Denko Materials Co., Ltd.
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FRP PRECURSOR AND METHOD FOR MANUFACTURING...
- Publication number 20200376715
- Publication date Dec 3, 2020
- Hitachi Chemical Company, Ltd.
- Ryohta SASAKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PREPREG, LAMINATE, PRINTED WIRING BOARD, CORELESS SUBSTRATE, SEMICO...
- Publication number 20200239653
- Publication date Jul 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuma YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...
- Publication number 20200107437
- Publication date Apr 2, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko SAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...
- Publication number 20200056006
- Publication date Feb 20, 2020
- Hitachi Chemical Company, Ltd.
- Hiroshi YOKOTA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED SILOXANE COMPOUND HAVING AROMATIC AZOMETHINE, THERMOSETTIN...
- Publication number 20140192501
- Publication date Jul 10, 2014
- Hitachi Chemical Company, Ltd.
- Tomohiko KOTAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND P...
- Publication number 20140000948
- Publication date Jan 2, 2014
- Shunsuke Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PR...
- Publication number 20130330563
- Publication date Dec 12, 2013
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRIN...
- Publication number 20120247820
- Publication date Oct 4, 2012
- Masato MIYATAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Shintaro Hashimoto

Person

Patents Grantslast 30 patents

Semiconductor device having dolmen structure and manufacturing meth...

Method for manufacturing semiconductor device having dolmen structu...

Prepreg for coreless substrate, coreless substrate and semiconducto...

Modified silicone compound, and thermosetting resin composition, pr...

Prepreg, laminate, printed wiring board, coreless substrate, semico...

Coreless substrate prepreg, coreless substrate, coreless substrate...

Siloxane compound, modified imide resin, thermosetting resin compos...

Resin composition, and printed wiring board, laminated sheet, and p...

Resin composition, prepreg laminate obtained with the same and prin...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFAC...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTU...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

METHOD FOR MANUFACTURING FRP PRECURSOR AND METHOD FOR MANUFACTURING...

PREPREG, LAMINATE, PRINTED WIRING BOARD, CORELESS SUBSTRATE, SEMICO...

CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...

PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...

MODIFIED SILOXANE COMPOUND HAVING AROMATIC AZOMETHINE, THERMOSETTIN...

RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND P...

MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PR...

RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRIN...