SHINTARO HAYASHI

Person

NAGANO-SHI, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Coil structure, lead frame, and inductor
- Patent number 12,283,413
- Issue date Apr 22, 2025
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil structure, lead frame, and inductor
- Patent number 12,073,985
- Issue date Aug 27, 2024
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device
- Patent number 12,062,600
- Issue date Aug 13, 2024
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, semiconductor device, and lead frame manufacturing method
- Patent number 11,791,250
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing lead frame
- Patent number 10,985,094
- Issue date Apr 20, 2021
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and electronic component device
- Patent number 10,818,579
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and leadframe
- Patent number 10,043,739
- Issue date Aug 7, 2018
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and electronic component device
- Patent number 10,008,437
- Issue date Jun 26, 2018
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and semiconductor device
- Patent number 9,984,958
- Issue date May 29, 2018
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device
- Patent number 9,831,158
- Issue date Nov 28, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe
- Patent number 9,793,194
- Issue date Oct 17, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with anchor-shaped lead
- Patent number 9,633,933
- Issue date Apr 25, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing IC card
- Patent number 6,797,543
- Issue date Sep 28, 2004
- Shinko Electric Industries Co., Ltd.
- Tetsuichiro Kasahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe and method of manufacturing a semiconductor device using...
- Patent number 6,700,192
- Issue date Mar 2, 2004
- Shinko Electric Industries Co., Ltd.
- Hideki Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing IC card
- Patent number 6,630,370
- Issue date Oct 7, 2003
- Shinko Electric Industries Co., Ltd.
- Tetsuichiro Kasahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna frame for IC card and process for manufacturing the same or...
- Patent number 6,557,767
- Issue date May 6, 2003
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, A...
- Publication number 20230197580
- Publication date Jun 22, 2023
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD OF MAKING LEAD FRAME, AND SEMICONDUCTOR DEVICE
- Publication number 20220208664
- Publication date Jun 30, 2022
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE, LEAD FRAME, AND INDUCTOR
- Publication number 20210350978
- Publication date Nov 11, 2021
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE, LEAD FRAME, AND INDUCTOR
- Publication number 20210350979
- Publication date Nov 11, 2021
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20200144166
- Publication date May 7, 2020
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20200098672
- Publication date Mar 26, 2020
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT DEVICE
- Publication number 20190115288
- Publication date Apr 18, 2019
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT DEVICE
- Publication number 20180061746
- Publication date Mar 1, 2018
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20170133300
- Publication date May 11, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEADFRAME
- Publication number 20170125328
- Publication date May 4, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20170117210
- Publication date Apr 27, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20170110389
- Publication date Apr 20, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame and Semiconductor Device
- Publication number 20160013120
- Publication date Jan 14, 2016
- Shinko Electric Industries Co., LTD.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for manufacturing IC card
- Publication number 20040023435
- Publication date Feb 5, 2004
- Shinko Electric Industries Co., Ltd.
- TETSUICHIRO KASAHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Leadframe and method of manufacturing a semiconductor device using...
- Publication number 20030071344
- Publication date Apr 17, 2003
- Shinko Electric Industries Co., Ltd.
- Hideki Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING IC CARD
- Publication number 20020177255
- Publication date Nov 28, 2002
- Shinko Electric Industries Co., Ltd.
- TETSUICHIRO KASAHARA
- G06 - COMPUTING CALCULATING COUNTING

SHINTARO HAYASHI

Person

Patents Grantslast 30 patents

Coil structure, lead frame, and inductor

Coil structure, lead frame, and inductor

Lead frame and semiconductor device

Lead frame, semiconductor device, and lead frame manufacturing method

Lead frame and method of manufacturing lead frame

Lead frame and electronic component device

Semiconductor device and leadframe

Lead frame and electronic component device

Leadframe and semiconductor device

Lead frame and semiconductor device

Leadframe

Lead frame with anchor-shaped lead

Process for manufacturing IC card

Leadframe and method of manufacturing a semiconductor device using...

Process for manufacturing IC card

Antenna frame for IC card and process for manufacturing the same or...

Patents Applicationslast 30 patents

LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, A...

LEAD FRAME, METHOD OF MAKING LEAD FRAME, AND SEMICONDUCTOR DEVICE

COIL STRUCTURE, LEAD FRAME, AND INDUCTOR

COIL STRUCTURE, LEAD FRAME, AND INDUCTOR

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME

LEAD FRAME AND ELECTRONIC COMPONENT DEVICE

LEAD FRAME AND ELECTRONIC COMPONENT DEVICE

LEADFRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND LEADFRAME

LEADFRAME

LEAD FRAME AND SEMICONDUCTOR DEVICE

Lead Frame and Semiconductor Device

Process for manufacturing IC card

Leadframe and method of manufacturing a semiconductor device using...

PROCESS FOR MANUFACTURING IC CARD