Shintaro Matsuda

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Hyogo, JP

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Patents Grantslast 30 patents

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Resin sealed semiconductor device for use in testing and evaluation...
- Patent number 5,204,540
- Issue date Apr 20, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Yuichi Nakashima
- H01 - BASIC ELECTRIC ELEMENTS